United Microelectronics Center Co., Ltd

Junbo Feng

Jin Guo

Qiang Li

Jiguang Zhu

Guowei Cao

Shengping Liu

Bowen Li

Jianzhong Han

Heng Zhao

Boling Ouyang

Yang Zhao

Ye Tian

Chao Peng

Naidi Cui

Wei Wang

A programmable optical chip and a terminal is provided, wherein the optical chip includes: one or more first transmission paths for transmitting an optical signal in the programmable optical chip; first programmable basic devices arranged in an array; and optical IP cores, wherein the optical IP cores and the first programmable basic devices are optically coupled, and the optical IP cores are optically coupled. The optical IP cores include optical soft cores and/or optical firm cores. Each type of optical soft core includes second programmable basic devices and one or more second transmission paths for transmitting the optical signal in the optical soft core. Each type of optical firm core includes third programmable basic devices, one or more third transmission paths for transmitting the optical signal in the optical firm core, and first optical devices used to process the optical signal. In the solution of the present disclosure, operations such as programming are performed on the optical chip such that the optical chip can implement a plurality of different functions.

Programmable optical chip and terminal

An edge coupler and a fabrication method therefor are provided. The method includes: providing a semiconductor-on-insulator substrate, the semiconductor-on-insulator substrate including a first substrate, an insulating layer on the first substrate, and a semiconductor layer on the insulating layer; patterning the semiconductor layer to form a first waveguide; forming a first dielectric layer on the insulating layer; forming a second dielectric layer on the first dielectric layer and the first waveguide; forming a second waveguide on the second dielectric layer; forming a third dielectric layer covering the second waveguide; bonding the third dielectric layer to a carrier substrate on a side of the third dielectric layer away from the second waveguide; removing the first substrate; and forming a fourth dielectric layer on a surface of the insulating layer.

Edge coupler and manufacturing method therefor

A digital signal modulation method for a photon artificial intelligence computing chip, including: modulating one or more groups of digital electrical signals into optical signals; where the group of digital electrical signals comprises several timing signals being outputted in sequence in a channel within a fixed period; where each timing signal has the same base clock and signal time length; where each timing signal conveying N-bit digital information has 2−1 base clocks, the number of the base clocks of a high-level signal or the number of a digital signal '1' in the timing signal is a signal value of the timing signal, and the signal value is equal to a value of the N-bit digital information being transmitted; and where the timing signal is a modulating signal for converting the electrical signal to the optical signal. Compared with the existing calculation scheme based on digital-to-analog conversion and analog signal modulation, the calculation scheme in the present invention avoids using a digital-to-analog converter with a high cost and power consumption, can be directly connected with the digital signals of the electronic chip, and avoids quantization error during the digital-to-analog conversion of digital signals.

Digital signal modulation method for a photon artificial intelligence computing chip

A coupling alignment device and method for a laser chip and a silicon-based optoelectronic chip are disclosed. The device comprises a transfer mold which includes a substrate, first protrusions, and second protrusions. The first protrusions are provided with through holes and are used for being clamped into first recesses in the laser chip; and the second protrusions are used for being clamped into second recesses in the silicon-based optoelectronic chip. The coupling alignment is achieved by etching the first recesses in the laser chip, etching the second recesses in the silicon-based optoelectronic chip, etching the first protrusions, the second protrusions, and the through holes in the transfer mold. A flip-chip suction nozzle is connected with the transfer mold, which is in alignment with the laser chip, and picks up the laser chip by means of the through holes. Then, the laser chip is assembled on the silicon-based optoelectronic chip by aligning and contacting the transfer mold with the silicon-based optoelectronic chip. The method is of high precision, high efficiency, low costs, and can achieve large-scale and mass production.

Coupling alignment device and method for laser chip and silicon-based optoelectronic chip

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Chongqing, China

Junbo Feng