Playnitride Inc.

Jun-Yu Lin

Sheng-Yuan Sun

Kuan-Yung Liao

Yun-Li Li

Po-Jen Su

Gwo-Jiun Sheu

Wen-Jie Lu

A light emitting device includes a heat dissipation casing and an LED module. The heat dissipation casing includes an upper cover, a lower cover and a plurality of side covers. The upper cover has a plurality of first holes. The lower cover and the upper cover are opposite to each other. The side covers are connected to the upper cover and the lower cover, wherein there are at least two chamfered surfaces between the at least two side covers and the upper cover, and the chamfered surfaces have a plurality of second holes. The LED module is disposed inside the heat dissipation casing and located on the lower cover. The LED module has a light emitting surface, and the light emitting surface and the first and the second holes are respectively located on opposite sides of the LED module.

Light emitting device

An optical module including a reflecting component, a plurality of first light sources and a wavelength conversion body is provided. The reflecting component has a main axis and a focal point located on the main axis. The first light sources are located at one side of the reflecting component and each of the first light sources emits a first light parallel to the main axis towards the reflecting component. The wavelength conversion body is disposed on the focal point, wherein the first lights are reflected to the focal point via the reflecting component and a part of the first lights are converted to a second light via the wavelength conversion body. The second light and another part of the first lights are projected to the reflecting component and form a light beam parallel to the main axis via reflection by the reflecting component.

Optical module

A light-emitting module including a light emitting component, a heat dissipation element, and a light-converting component is provided. The light-emitting component is adapted to emit a light beam. The heat dissipation element is disposed at one side of the light-emitting component, wherein the heat dissipation element has a light through hole and the light through hole is located at a transmission path of the light beam. The light-converting component is connected to the heat dissipation element and covers the light through hole.

Growing community of inventors

Tainan, Taiwan

Jun-Yu Lin