Sumitomo Electric Industries, Limited

Sumitomo Electric Fine Polymer, Inc.

Other

Jun Yorita

Ryosuke Hata

Yoshihiro Hirata

Tsuyoshi Haga

Hiroshi Takigawa

Masatoshi Majima

Hideki Kashihara

Hideaki Toshioka

Shinji Inazawa

Tomomi Sano

Michiko Takushima

Kazuo Nakamae

Masamichi Yamamoto

Nobuyoshi Tatoh

Masaya Nishi

Keiji Koyama

Kazunori Okada

Hidemitsu Kuwabara

Morihiro Seki

Mamoru Kondo

Toshihiro Sakamoto

Takahiro Horikawa

Katsunari Mikage

Yuichi Ashibe

Yoshie Tani

Misako Osoegawa

Toshiyuki Numazawa

Katsuhiko Katayama

Toru Tsujioka

A lens componentcomprises K unit lenses, each extending in the X direction and having a common structure, arranged in parallel at a minimum period Pin the Y direction. Each unit lensincludes two partial lensessectioned within the minimum period Pin the Y direction and a flat partdisposed between the partial lenses. The partial lenseshave respective optical axes different from each other but parallel to the Z direction and form images of a common point on an object surface onto an image surface A at respective positions different from each other.

Lens component and image display device

A three-dimensional optical sheet is arranged between optical elements and a substrate for optically connecting the optical elements and the substrate and includes a sheet section, convex lens sections, and reflecting sections. The sheet section has first and second main surfaces. The convex lens sections are provided on the first main surface for collecting light. The reflecting sections are provided on the second main surface and change the direction of light traveling along the second main surface such that the light enters the convex lens sections.

Optical sheet, and mounting method and optical module using the optical sheet

In a processing method of a fine structure according to the present invention, an opposed platen () is moved from a retreat position to a molding/processing position, so that a film () is pressed against a mold () and processed. Thereafter a second block () is separated from a first block (). Thus, improvement of the cooling rate for the opposed platen () can be attained by reducing the total thermal capacity of the opposed platen () by reducing the volume of the opposed platen () in cooling and physically discharging heat stored in the opposed platen (). Thus, cooling efficiency for the opposed platen () is improved, and the heat cycle of the opposed platen () can be reduced.

Processing method of fine structure and processing equipment for fine structure

An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 &#x3bc;m-20 &#x3bc;m when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

Anisotropic conductive film and method for producing the same

A method of manufacturing a metal microstructure () by using a resin mold (). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold () can be set and the high-precision metal microstructure () can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure () according to the present invention includes the steps of: fixing on a conductive substrate () the resin mold () having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer () having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure () having the resin mold (); exposing the layered structure () having the resin mold () to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer () existing at the vacant portion of the resin mold (); and filling with a metal () the vacant portion of the layered structure () having the resin mold () by electroforming.

Method for manufacturing metal microstructure

A method of producing a fine metal component where a plated coating is deposited on a conductive film exposed at fine through-hole pattern portions in a mold to produce a fine metal component, wherein the conductive film is made using a conductive paste comprised of a metal powder in which the metal particles are magnetically linked together in a chain shape.

Plating and production methods for producing a fine metal component using a conductive paste

A method of manufacturing a contact probe includes an electroforming step of, using a resist film () arranged on a substrate () as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film () to form a metal layer (), a tip end shaping step of obliquely removing and sharpening that part of the metal layer () which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer () from the pattern frame.

Contact probe, method of manufacturing the contact probe, and device and method for inspection

A method of manufacturing a metal microstructure by using a resin mold. In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold can be set and the high-precision metal microstructure can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure according to the present invention includes the steps of: fixing on a conductive substrate the resin mold having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure having the resin mold; exposing the layered structure having the resin mold to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer existing at the vacant portion of the resin mold; and filling with a metal the vacant portion of the layered structure having the resin mold by electroforming.

A circuit board comprising a first metal layer formed in patterns on a ceramic substrate, a second metal layer formed in patterns on the first metal layer, and a third metal layer formed covering the top surface of the second metal layer and the majority of the side surface, wherein the first and partial second metal layers not covered by the third metal layer are reduced in width by etching. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high-output module by mounting at least one high-output semiconductor element thereon.

Circuit board, method for manufacturing same, and high-output module

A cable and cable system is provided having a conductor and an insulation layer on an outer circumference of a conductor. The insulation layer is impregnated with a medium-viscosity insulating oil that has a viscosity of 10 centistokes (cst) to less than 500 cst at 60&deg; C. The insulation layer includes an insulating tape that may be one or a combination of composite tape having a polyolefin resin film laminated with a kraft paper on both its sides and an insulating tape including a polyolefin resin film. The cable includes a metal sheath provided on an outer circumference of the insulation layer, and a reinforcing layer formed on an outer circumference of the metal sheath. The reinforcing layer reinforces the metal sheath by absorbing hoop stress exerted on the metal sheath. The cable system includes a submarine-portion cable and a land-portion cable, an oil stop joint box, and an oil feeding tank. The oil stop joint box connects the submarine-portion cable to the land-portion cable, and the oil feeding tank is connected to the land-portion cable which feeds the medium-viscosity insulating oil to the land-portion cable.

Solid cable, manufacturing method thereof, and transmission line therewith

Disclosed is an electrical insulating laminated paper prepared by a process which comprises the steps of melt-extruding a polyolefin resin as a binder onto one or two sheets of a kraft insulating paper by means of a extruder to obtain a laminated paper, and calendering or supercalendering the laminated paper so that the total thickness thereof is from 30 to 200 &mgr;m and the proportion of a polymer comprising the polyolefin resin is from 40 to 90%. The laminated paper is excellent in dielectric properties, dielectric strength, and mechanical properties such as adhesive strength.

Electrical insulating laminated paper, process for producing the same oil-impregnated power cable containing the same

A solid DC cable is made of a conductor having multilayered insulating layer around the outer circumference of the conductor. The insulating layer has a layering configuration selected from one of the following arrangements: (i) a main insulating layer and a low resistance tape layer, where the low-resistance tape layer contains carbon paper that has a volume resistivity which is smaller than that of the main insulating layer; (ii) a main insulating layer containing kraft paper, and a low-resistance insulating layer containing a low resistance kraft paper having a resistivity smaller than the kraft paper of the main insulating layer; (iii) a main insulating layer containing a composite tape, where the tape is contains a laminate of a low-loss plastic film and kraft paper, and a low-resistance insulating layer containing kraft paper having a resistivity lower than the main insulating layer; or (iv) a low-resistance tape layer containing carbon paper described in (i), a low-resistance insulating layer containing the low-resistance kraft paper described in (ii) and a main insulating layer. The low-resistance insulating layer or the low-resistance tape layer is positioned above the conductor in a region where the pressure of the insulating oil becomes negative when a voltage load is cut off.

Growing community of inventors

Hyogo, Japan

Jun Yorita