Panasonic Intellectual Property Management Co., Ltd.

Jun Yokoyama

Yohei Takechi

Takashi Urashima

Daichi Higashi

A laser processing apparatus includes a laser oscillator that oscillates processing laser light to be incident on a processing point on a processing surface of a workpiece, a coupling mirror that deflects or transmits the processing laser light and measurement light to be incident on the processing point toward the processing point, a measurement light deflection unit that changes an incident angle of the measurement light on the coupling mirror, a lens that concentrates the processing laser light and the measurement light on the processing point, a controller that controls the laser oscillator and the measurement light deflection unit, a measurement processor that measures a depth of a keyhole generated at the processing point by the processing laser light by using an optical interference signal based on an interference generated by an optical path difference between the measurement light reflected at the processing point and reference light, and a beam position measurement unit that measures positions of the processing laser light and the measurement light.

Laser processing apparatus and laser processing method

Laser processing apparatus includes movable mirror for changing paths of laser light for processing and measurement light, and stage for changing an incident angle of measuring light. Furthermore, laser processing apparatus includes lens for condensing laser light for processing and measurement light on processing point, controller for controlling laser oscillator, movable mirror, and stage based on corrected data for processing, and measurement processor for measuring a depth of keyhole generated at processing point. The corrected data for processing is data corrected so as to a deviation of an arrival position of at least one of laser light for processing and measurement light caused by chromatic aberration of lens on the surface of workpiece. With this configuration, an accurate depth of keyhole can be measured.

Laser processing apparatus, laser processing method, and correction data generation method

A laser processing apparatus sets a processing section passing through a target position on a processing surface, sets a measurement section centered on the target position in the processing section, sets a plurality of data acquisition positions that are trajectories perpendicular to a processing direction in the measurement section. The laser processing apparatus acquires pieces of measurement data indicating shapes of keyholes at the respective data acquisition positions during processing of the processing section, and projects the pieces of measurement data in the processing direction to be superimposed on each other to create projection data. The laser processing apparatus obtains the second instruction value in a direction perpendicular to the processing direction at the target position on the basis of the projection data. Therefore, it is possible to provide a laser processing apparatus and a laser processing method capable of accurately measuring a depth of a keyhole.

A laser processing apparatus emits processing light, measurement light, processing guide light, and measurement guide light with which a surface of a workpiece is irradiated. Respective wavelengths of the processing guide light and the measurement guide light are set to wavelengths at which a deviation amount between an irradiation position of the processing guide light and an irradiation position of the measurement guide light due to a chromatic aberration of magnification of a lens, and a deviation amount between an irradiation position of the processing light and an irradiation position of the measurement light due to the chromatic aberration of magnification of the lens are equal to each other. Therefore, positioning of spot positions of a plurality of laser lights having different output differences can be realized with high accuracy and high speed.

Laser processing apparatus and optical adjustment method

A laser processing apparatus is used which includes: a laser oscillator that oscillates a processing laser beam at a processing point to be processed on a surface of a workpiece; an optical interferometer that emits a measurement beam to the processing point and generates an optical interference intensity signal based on interference generated due to an optical path difference between the measurement beam reflected at the processing point and a reference beam; a first mirror that changes traveling directions of the processing laser beam and the measurement beam; a second mirror that changes an incident angle of the measurement beam onto the first mirror; a lens that focuses the processing laser beam and the measurement beam on the processing point; a memory that stores corrected processing data; a control unit that controls the laser oscillator, the first mirror, and the second mirror based on the corrected processing data; and a measurement processing unit that derives a depth of a keyhole generated at the processing point by the processing laser beam, based on the optical interference intensity signal.

OCT measuring device in the present exemplary embodiment includes: wavelength sweep light source that emits light of which a wavelength is swept; optical interferometer that divides the light into measurement light and reference light, emits measurement light toward measurement surface of measuring target object, and generates an optical interference intensity signal indicating an intensity of interference between measurement light reflected from measurement surface and reference light; electro-optic element which is a phase modulator arranged in a light path of optical interferometer; measurement processor which is a signal generator that derives a position of measurement surface and generates a phase amount indicator signal that indicates a phase amount of phase modulator based on the optical interference intensity signal; and electro-optic element controller which is a phase amount controller that controls the phase amount given to the light that is transmitted through phase modulator.

OCT measuring device and oct measuring method

A laser welding apparatus includes: a laser oscillator configured to emit a laser beam toward a welding portion of a welded material; an optical interferometer configured to generate an interference signal that indicates an intensity of an interference beam of a measurement beam reflected by the welding portion and a reference beam; and a derivation unit configured to generate, based on the interference signal, two-dimensional tomographic image data indicating a correlation among a distance in a proceeding direction of welding of the welding portion, a depth of the welding, and an intensity of the interference signal, to extract specified depth tomographic image data within a specified range from the two-dimensional tomographic image data, and to derive a depth for each distance based on the intensity of the interference signal in the specified depth tomographic image data.

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Osaka, Japan

Jun Yokoyama