Taiwan Semiconductor Manufacturing Comp. Ltd.

Jun-Yi Ruan

Chih-Chien Chi

Chen-Yuan Kao

Yao-Jen Chang

Po-Cheng Shih

Kai-Shiang Kuo

Hung-Wen Su

Tze-Liang Lee

Chung-Chi Ko

Chia-Cheng Chou

A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.

Multi-layer film device and method

A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.

Interconnect structure and method

Growing community of inventors

Taoyuan, Taiwan

Jun-Yi Ruan