Panasonic Intellectual Property Management Co., Ltd.

Jun Yasumoto

Hiroharu Inoue

Hiroaki Umehara

Fumito Suzuki

Rihoko Watanabe

Teppei Washio

A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tan δ=E″/E') of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tan δ=E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.

Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.

Growing community of inventors

Fukushima, Japan

Jun Yasumoto