Honor Device Co., Ltd.

Asia Vital Components (shen Zhen) Co., Ltd.

Shenzhen Tcl Digital Technology Ltd.

Jun Xiang

Qian Wang

Xiaoyuan Wang

Yang Zhang

Yin Wang

Liang Yang

Zhiqiang Jiang

Xiao-Xiang Zhou

Xiaoxu Dong

Kuei-Feng Chiang

Dingfa Huang

Haiyun Sun

Mobile phone

A far-field speech support with a lens function and an electrical device are provided. The far-field speech support includes: a base, a far-field speech board installation portion disposed on the base and configured to install a far-field speech board, a transparent light guide plate disposed on a bottom side of the far-field speech board installation portion, a buckle structure disposed on the base and configured to install an infrared receiving head assembly, and an infrared reflective portion disposed corresponding to the transparent light guide plate and disposed below the infrared receiving head assembly. The far-field speech support acts as a lens, provides an installation space for the far-field speech board, and facilitates installation of the far-field speech board.

Far-field speech support with lens function and electrical device

A loop heat pipe structure includes a transport pipe, an evaporator, a first wick layer, a second wick layer, and a plurality of grooves. The transport pipe communicates with the evaporator. The evaporator has a bottom and internally defines a first chamber and a second chamber, and has a working fluid filled therein. The first wick layer is located on the bottom, and the second wick layer is located on and covers the first wick layer. The grooves can be selectively provided on the first wick layer or the bottom. The first and second wick layers are so designed that the situation of very high vapor pressure would not occur in the second chamber, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.

Dual chamber loop heat pipe structure with multiple wick layers

A loop heat pipe structure includes an evaporator and a first pipe. The evaporator has a first chamber, a first wick layer, and a bottom. The first wick layer is provided in the first chamber. The first pipe includes a first inlet and a first outlet communicably connected to the evaporator. The first inlet internally defines a second chamber communicable with the first wick layer. By providing the second chamber outside the evaporator, the evaporator can have a reduced overall height without creating very high vapor pressure in the evaporator, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.

Loop heat pipe structure with low-profile evaporator

Growing community of inventors

Shenzhen, China

Jun Xiang