Samsung Display Co., Ltd.

Jun Woo Hong

Hae Kwan Seo

Bong Hyun You

Joon Chul Goh

Su Hyeong Park

There is provided a pixel including an organic light emitting diode (OLED), a first transistor having a first electrode connected to a first power source and configured to control an amount of current supplied from the first power source to the OLED in response to a data signal, a second transistor and a third transistor connected between a second electrode and a gate electrode of the first transistor, and a fourth transistor connected between an initializing power source and a first node that is a common node of the second transistor and the third transistor.

Pixel and organic light emitting display device using the same

A flexible display includes a flexible substrate, a metal material coupled to the flexible substrate, and at least one electromagnet coupled to the flexible substrate. The electromagnet generates a force to attract the metal material when the flexible substrate changes from a first state to a second state. The force assists in holding the flexible substrate in the second state, which may be a rolled state, folded state, or another changed state. The flexible substrate includes a display area corresponding to a plurality of pixels for generating an image.

Flexible display and fixing method thereof

A display device includes a panel substrate, a first printed circuit board (PCB), a driver integrated circuit (IC), and a second PCB. The panel substrate includes a first substrate and a second substrate. The first PCB is disposed on the second substrate. The driver IC is disposed on the first substrate and is electrically connected to the first PCB. The second PCB is disposed on the first substrate and is electrically connected to the driver IC. The driver IC includes a first pad and a second pad. The first pad is disposed on an upper or lateral surface of the driver IC, the first pad being configured to transmit signals received via the first PCB. The second pad is disposed on a lower surface of the driver IC, the second pad being configured to receive the signals from the first PCB and to transmit the signals to the second PCB.

Growing community of inventors

Yongin, South Korea

Jun Woo Hong