Samsung Electronics Co., Ltd.

Shin-etsu Chemical Co., Ltd.

Yonsei University

Jun-won Han

Jae-Hyun Kim

Tae-hoon Kim

Jung-sik Choi

Hideto Kato

Michihiro Sugo

Hiroyuki Yasuda

Shohei Tagami

KangTaek Lee

Seung-won Kim

Yeon-woo Kim

You-Jeong Jeong

Cheol-sang Yoon

Hye-yun Park

Hyungjoon Jeon

Young-Geon Song

Ho-Geun Lee

A hybrid composite film, a method of fabricating the hybrid composite film, and an integrated circuit device including the hybrid composite film, the hybrid composite film including a polymer film; and a plurality of organic-inorganic composite particles dispersed in the polymer film, wherein each particle of the plurality of organic-inorganic composite particles includes an inorganic particle and an organic capping layer surrounding the inorganic particle, the organic capping layer having a hydroxyl group-terminated end.

Hybrid composite film, method of fabricating the same, and integrated circuit device including hybrid composite film

A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.

Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same

A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate.

Wafer supporting structure, intermediate structure of a semiconductor package including the wafer supporting structure

Growing community of inventors

Seoul, South Korea

Jun-won Han