Agency for Science, Technology and Research

Omnivision Technologies, Inc.

Jun Wei

Jiyan Wu

Stephen Chee Khuen Wong

Hui Pan

Shunbo Mou

Yongling Wu

Fern Lan Ng

Zhiping Wang

Hong Xie

Zhizhuan Wen

Sharon Mui Ling Nai

Haiyang Fang

Jilai Qian

A smart camera system including an image sensor and a controller is presented. The image sensor generates video data that is initially at a bit rate of a pre-determined bit rate value. The controller is coupled to the image sensor to transmit the video data. The controller includes a processor operating at a clock rate of a first frequency. The processor is coupled to memory, the memory including instructions, which when executed by the controller causes the smart camera system to perform operations. The operations include dynamically scaling the clock rate of the processor to an adjustment frequency in response to receiving an input to change the bit rate of the video data. The adjustment frequency for the clock rate of the processor based, at least in part, on the input bit rate value. The operations further include changing the bit rate to the input bit rate value. The input bit rate value being different than the pre-determined bit rate value and the first frequency being different than the adjustment frequency.

Quality-driven dynamic frequency scaling for energy optimization of smart camera systems

Systems and methods for buffer-aware transmission rate control for real-time video streaming are disclosed herein. An example method includes transmitting a first video packet at a transmission rate based on a buffer fill ratio of a buffer, where the transmission rate is adjusted in response to changes of the buffer fill ratio, selectively retransmitting a second video packet in response to a negative acknowledgement packet, where selectively retransmitting the second video packet is at least based on whether the second video packet has been previously retransmitted, a buffer level of the buffer, and a retransmission rate, and selectively retransmitting a third video packet in response to a non-receipt of an acknowledgement packet within a retransmission timeout, wherein selectively retransmitting the third video packet is at least based on whether the third video packet has been previously retransmitted, the buffer level of the buffer, and the retransmission rate.

Buffer-aware transmission rate control for real-time video streaming system

A system includes an image sensor and a sending controller. The image sensor to generate video data at a source bit rate. The sending controller is coupled to the image sensor to transmit communication data representative of the video data. The sending controller includes one or more processors coupled to memory. The memory includes instructions, which when executed by the sending controller causes the system to perform operations. The operations include determining a first bit rate to encode a first portion of the video data, generating a first video packet representative of the first portion by encoding the first portion at the first bit rate, and determining whether to transmit the first video packet as the communication data with the sending controller based on at least one of a transmission rate threshold, a transmission interval threshold, or a buffer fill threshold.

Embedded multimedia systems with adaptive rate control for power efficient video streaming

Methods and systems for streaming low-delay, high-definition video with partially reliable transmission are disclosed herein. An example method includes determining a per-frame maximum retransmission allocation for a plurality of video packets based at least in part on a frame priority, where the plurality of video packets form at least a portion of the frame, determining a retransmission timeout for each video packet of the plurality of video packets based at least in part on a round trip time, and transmitting the plurality of video packets under traffic rate control.

Method and system for streaming low-delay high-definition video with partially reliable transmission

A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.

Method of fabricating microelectromechanical system structures

A method of bonding two components by depositing an amorphous and non-hydrogenated intermediate layer () on one of the components () and arranging the components () in spaced relationship with the intermediate layer () therebetween. The method further comprises heating one or both of the components () before bringing the components () into contact. Finally, a voltage is applied to the components () to create a permanent bond between the two components.

Method of wafer/substrate bonding

A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed over the first conductive layer. A second conductive layer is formed over the lower surface of the second ceramic component. The second ceramic component is stacked over the first ceramic component wherein the second conductive layer on the second ceramic component opposes the intermediate film on the first component. The first and second ceramic components are anodically bonded together.

Growing community of inventors

Singapore, Singapore

Jun Wei