Murata Manufacturing Co., Ltd.

Jun Urakawa

Jun Adachi

Issei Yamamoto

Yoichi Moriya

Yasutaka Sugimoto

Takahiro Sumi

Naoya Mori

Mitsuyoshi Nishide

Takayuki Tsukizawa

Kumiko Hiehata

Takashi Noma

Isao Kato

Masato Nomiya

Tsuyoshi Katsube

Tsutomu Tatekawa

Takahiro Kitazume

Tomonori Ito

Machiko Motoya

Norio Yoshida

Ai Sasaki

Takahiro Kitadume

Yukinobu Sato

An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity.

ESD protection device

ESD protection device and method for manufacturing the same

A monolithic ceramic electronic component includes at least two types of stacked ceramic layers having different dielectric constants and also includes internal electrodes partially disposed along boundaries between the ceramic layers having different dielectric constants. The internal electrodes include an additive component common to a component included in at least one of the ceramic layers adjacent to each other with the internal electrodes placed therebetween.

Monolithic ceramic electronic component

The ESD protection device includes: opposed electrodesincluding an opposed electrodeon one side and an opposed electrodeon the other side, and a discharge auxiliary electrode, the discharge auxiliary electrode being placed so as to extend from the opposed electrode on one side to the opposed electrode on the other side, wherein the discharge auxiliary electrode contains metal grains, semiconductor grains and a glass material, the metal grains, the semiconductor grains, and the metal grain and the semiconductor grain are bound together, respectively, via the glass material, the average grain size X of the metal grains is 1.0 &#x3bc;m or more, and the relationship between the thickness Y of the discharge auxiliary electrode and the average grain size X of the metal grains satisfies the requirement of 0.5&#x2266;Y/X&#x2266;3.

ESD protection device and manufacturing method therefor

A substrate including an ESD protection function includes an insulating substrate, at least one of circuit elements or a wiring pattern and an ESD protection portion. In the ESD protection portion, facing portions of at least one pair of discharge electrodes are disposed in a cavity provided in the insulating substrate so that the ends face each other. The discharge electrodes are electrically connected to the circuit elements and or the wiring pattern.

Substrate including an ESD protection function

An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including an exposed portion that is exposed in the cavity, and external electrodes provided on a surface of the insulating substrate and connected to the discharge electrodes. Supporting electrodes obtained by dispersing conductive powder in an insulating material defining the insulating substrate are provided along a bottom surface and a top surface that define the cavity between the exposed portions of the at least one pair of discharge electrodes.

An ESD protection device includes a ceramic multilayer substrate, at least one pair of discharge electrodes provided in the ceramic multilayer substrate and facing each other with a space formed therebetween, external electrodes provided on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode obtained by dispersing a metal material and a semiconductor material and being arranged in a region that connects the pair of discharge electrodes to each other.

An ESD protection device includes opposed electrodes in a ceramic base material and a discharge auxiliary electrode in contact with each of the opposed electrodes which is arranged so as to provide a bridge from the opposed electrode on one side to the opposed electrode on the other side, the discharge auxiliary electrode includes metallic particles, semiconductor particles, and a vitreous material, and bonding is provided through the vitreous material between the metallic particles, between the semiconductor particles, and between the metallic particles and the semiconductor particles. The metallic particles have an average particle diameter X of about 1.0 &#x3bc;m or more, and the relationship between the thickness Y of the discharge auxiliary electrode and the average particle diameter X of the metallic particles satisfies about 0.5&#x2266;Y/X&#x2266; about 3.

To provide a ceramic composition not only having little compositional variation after burning, but a high flexural strength of the sintered body, and a high Q value in a microwave band, a ceramic composition used for forming a ceramic layer of a multi-layer ceramic substrate contains 47.0 to 67.0 wt. % of SiO, 21.0 to 41.0 wt. % of BaO, and 10.0 to 18.0 wt. % of AlO, and contains as a first additive, 1.0 to 5.0 parts by weight of CeO, relative to a total of 100 parts of SiO, BaO and AlO, and as a second additive, 2.5 to 5.5 parts by weight of MnO, relative to a total of 100 parts by weight of SiO, BaO, AlOand CeO, and is substantially free of Cr. As a third additive, at least one of Zr, Ti, Zn, Nb, Mg and Fe, and as a fourth additive, a Co component and/or a V component, may be contained.

Ceramic composition, method for producing the same, ceramic substrate and method for producing ceramic green layer

An ESD protection device has a structure that allows ESD characteristics to be easily adjusted and stabilized. The ESD protection device includes a ceramic multilayer substrate, at least a pair of discharge electrodes located in the ceramic multilayer substrate and facing each other with a space disposed therebetween, and external electrodes located on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode disposed in a region that connects the pair of discharge electrodes. The supporting electrode is made of a conductive material coated with an inorganic material having no conductivity.

A dielectric ceramic composition includes about 10% to about 40% by weight of BaO, about 20% to about 65% by weight of SiO, about 6% to about 40% by weight of AlO, about 1% to about 15% by weight of BO, about 0.3% to about 3% by weight of CrO, and about 1% to about 40% by weight of ZrO. A multilayer ceramic substrate has a laminated structure including an inner layer portion and outer layer portions that have a smaller thermal expansion coefficient than that of the inner layer portion. The use of the dielectric ceramic composition for the outer layer portions enables the ceramic to be resistant to erosion caused by a plating liquid used for plating external conductive films, thus maintaining good adhesiveness between the external conductive films and the outer layer portions.

Dielectric ceramic composition, ceramic substrate, and method for producing the same

An ESD protection device includes a ceramic multilayer board, a cavity disposed in the ceramic multilayer board, at least one pair of discharge electrodes having ends, edges of the ends being opposed to each other at a predetermined distance in the cavity, and external electrodes disposed on outer surfaces the ceramic multilayer board and connected to the discharge electrodes. The ceramic multilayer board includes a composite portion, which is disposed in the vicinity of the surface on which the discharge electrodes are disposed and is at least disposed adjacent to the opposed ends of the discharge electrodes and to a space between the opposed ends. The composite portion includes a metal material and a ceramic material.

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Omihachiman, Japan

Jun Urakawa