Matsushita Electric Works, Ltd.

Jun Tatsuta

Shinobu Kida

Kenichiro Tanaka

Norio Yoshida

Masao Kubo

Hirokazu Yoshioka

Nobuyuki Asahi

Ikko Kuzuhara

Shigenari Takami

Mikio Masui

Kyoji Tanaka

Hiroyuki Yoshida

Yoshiharu Sanagawa

In a photoelectric device-part, a bonding pad is formed without increasing a plane area of a concave part for housing a photoelectric device to implement miniaturization and improvement of the light usability efficiency. A light reflecting surfaceof nearly a parabola configuration or the like provided for light emission and reception by a photoelectric deviceis formed on a slanting curved surface constituting a concave partof a circuit substrateA convex portionprojecting from the light reflecting surfaceand a receding concave portionare formed in the middle of the concave partA stageis formed by an upper and bottom surfaces of the convex and concave portionsandrespectively. A bonding padfor connecting circuits of the photoelectric deviceis formed at the stageSince a space for the bonding padis provided by both concave and convex portions, deformation of the light reflecting surfacecaused by the receding concave portionand a ratio of intrusion to the bottom surface of the concave part by the projecting convex portioncan be both minimized. As a result, the photoelectric devicecan be mounted without largely lowering light emission efficiency or without decentering the light emitting and receiving center, whereby a photoelectric device-partcan be miniaturized.

Photoelectric device

A semiconductor-chip mounting substrate with a high degree of reliability of an electrical connection between a substrate and a semiconductor chip such as IC chips is provided. The substrate has at least one projection thereon, which is integrally molded with the substrate. A conductive layer is formed on the projection to obtain a first bump. The semiconductor chip has a terminal projecting as a second bump on its surface. The semiconductor chip is mounted on the substrate such that the first bump contacts the second bump. A required contact pressure between the first bump and the second bump is held by use of a pressure holding means.

Semiconductor-chip mounting substrate having at least one projection thereon and a pressure holding means

The printed circuit board comprises a substrate 1 including a part loading portion 3 into which an electronic part 5 can be loaded, a plurality of contact terminals 2 which are respectively formed on one surface of the substrate 1 and the surfaces of which are exposed to the outside to provide external contacts, and openings 4 respectively formed in the other surface of the substrate 1 for insertion of bonding wires 6 which are used to connect the electronic part 5, which are to be loaded into the part loading portion 3 of the substrate 1, to its associated contact terminals 2. In the printed circuit board, each of the contact terminals 2 is formed of a metal foil 9 directly and closely attached to the substrate 1. This can prevent the lowered heat resistance of a printed circuit board which occurs when the metal foil, which is used to form the contact terminals 2, is bonded to the substrate 1 using an adhesive.

Print circuit board

A surface treating process with respect to conductor parts on printed circuit board irradiates an energy beam onto the surface of the conductor parts each in a plurality of layers of different, single metal material, with the intensity, dosage and the like optimumly set and under such irradiating conditions that the respective metal material of the conductor parts do not form any mutual alloy, and the surface of the conductor parts on the printed circuit board can be thereby excellently treated as desired.

Surface treating process involving energy beam irradiation onto

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Tsu, Japan

Jun Tatsuta