Fujitsu Corporation

Jun Taniguchi

Hiroki Uchida

Minoru Ishinabe

Hiroaki Date

Hideshi Tokuhira

Masanobu Ishiduka

Takeshi Shioga

Yoshihiro Mizuno

Hideo Kubo

Yoshinori Uzuka

Nobumitsu Aoki

Takeshi Soeda

Seiji Hibino

Susumu Ogata

Masatomo Asano

Nobuhiro Nanri

A quality determination method includes: in a quality determination space, mapping a quality of a package product in which a plurality of devices are assembled in accordance with a predetermined design condition, with use of each test result of each of the plurality of devices; and determining a quality of the package product, on a basis of mapping result of the mapping.

Quality determination method, quality determination device, quality determination system and computer-readable non-transitory medium

A semiconductor device includes: a first semiconductor element; a first substrate provided on the first semiconductor element and including a cavity with reduced pressure; coolant held inside the cavity; a second semiconductor element provided on the first substrate; and a heat spreading member thermally connected to the first substrate and provided with a hole communicated with the cavity.

Semiconductor device, method of manufacturing the same, and electronic device

DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

Electronic device and complex electronic device

A loop heat pipe includes: an evaporator to convert liquid phase working fluid into vapor phase working fluid; a condenser to convert vapor phase working fluid into liquid phase working fluid; a first vapor line and a first liquid line to allow the evaporator to communicate with the condenser and form a circular main loop; and a second vapor line and a second liquid line to allow the evaporator to communicate with the condenser and form a circular auxiliary loop; wherein the evaporator includes a reservoir that temporarily stores the liquid phase working fluid, a first vapor collector that communicates with the first vapor line, a second vapor collector that communicates with the second vapor line, first wick disposed between the reservoir and the first vapor collector, and second wick disposed between the reservoir and the second vapor collector.

Loop heat pipe and electronic apparatus

A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Electronic apparatus

Electronic components differing in height (a CPUa capacitorand coil elements) are mounted on a printed circuit boardA heat-absorbing memberis provided above the printed circuit boardin such a way that the membercontacts not only the top surface of the CPUthat is the shortest but the sides of the capacitorand the coil elementsTo circulate a cooling medium, a flow pathis formed in the heat-absorbing memberHeat generated at the CPUis transmitted from its top surface to the cooling medium in the flow pathvia the heat-absorbing memberheat generated at the capacitorand the coil elementsis transmitted from their sides to the cooling medium in the flow pathvia the heat-absorbing member

Growing community of inventors

Kawasaki, Japan

Jun Taniguchi