Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Jun Takasou

Katsumi Miyawaki

Norio Higashisaka

A laser diode drive circuit includes a first transistor having a collector connected to an anode of a laser diode; a second transistor having a collector connected to a cathode of the laser diode; a constant current circuit connected between a ground point and emitters of the first and second transistors; a first high-pass filter connected between the base and the collector of the first transistor; and a second high-pass filter connected between the base and the collector of the second transistor.

Laser diode drive circuit

A molded semiconductor package has a lead frame to which an LSI is bonded, inner lead frames located on opposing sides of the lead frame, and wires. Each wire is connected between the LSI and a corresponding one of the inner lead frames. A distance between an edge of the lead frame (or an edge of the molded semiconductor package) and an end of inner lead frame is larger than a distance between another edge of the lead frame (or another edge of the molded semiconductor package) and an edge of an inner lead frame to minimize the length of wires connected to the lead frame.

Growing community of inventors

Tokyo, Japan

Jun Takasou