Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Jun Takaso

Shintaro Watanabe

Tsutomu Yoshimura

Tomoyuki Asada

Norio Higashisaka

Kazuhiro Iyomasa

Hiroaki Maehara

Takao Haruna

A semiconductor wafer includes semiconductor chips divided by a dicing line, one of the semiconductor chips including terminals of an identical potential; a wiring located on the dicing line, and electrically connecting the terminals to each other; and a pad electrically connected through the wiring to the terminals, wherein the pad is located entirely on the semiconductor chip and is not present on the dicing line.

Method for testing semiconductor wafer

A high frequency power amplifier includes: a first transistor for amplifying an input high-frequency signal; a second transistor for amplifying an output signal of the first transistor; a third transistor connected in parallel with the first transistor and for amplifying the input high-frequency signal; a first switching element connected between an output of the first transistor and an input of the second transistor; a second switching element connected between an output of the third transistor and the first switching element; third and fourth switching elements connected in series between the output of the first transistor and an output of the second transistor, and between the second switching element and the output of the second transistor; and a first capacitor connected between the third switching element and the fourth switching element.

High frequency power amplifier

A high frequency power amplifier includes first and second transistors connected in parallel and amplifying a high frequency signal; a first switch connected to outputs of the first and second transistors and which connects an input terminal selectively to first and second output terminals; a third transistor amplifying a signal output from the first output terminal of the first switch; and a second switch having a first input terminal connected to the third transistor, a second input terminal connected to the second output terminal of the first switch, and which selectively connects the first and the second input terminals to an output terminal of the second switch.

A driver circuit comprises: differential amplification stages connected in series, and at least two cross-point adjuster circuits respectively connected to at least two differential amplification stages of the differential amplification stages. The cross-point adjuster circuits control at least one of the positive-phase and negative-phase DC levels of a corresponding differential amplification stage and adjust the cross point of the output signals of the corresponding differential amplification stage.

Driver circuit and driver IC

An amplifier circuit includes a first differential amplifier circuit, a second differential amplifier circuit which amplifies an output signal from the first differential amplifier circuit, and an active feedback circuit which performs waveform shaping on the output signal from the first differential amplifier circuit by feeding back an output signal from the second differential amplifier circuit. The active feedback circuit includes first and second transistors having collectors or drains respectively connected to respective output nodes of the first differential amplifier circuit, bases or gates respectively connected to two output nodes of the second differential amplifier circuit, and emitters or sources connected in common, and a first current source which has a first end connected to the emitters or sources of the first and second transistors, and a second end connected to a low-voltage power supply, and producing a current that can be externally adjusted.

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Tokyo, Japan

Jun Takaso