Toshiba Memory Corporation

Kioxia Corporation

Jun Takagi

Dai Fukushima

Jun Takayasu

Masayoshi Adachi

Shinichi Hirasawa

In one embodiment, a semiconductor manufacturing apparatus includes a polisher configured to polish a film provided on a substrate. The apparatus further includes a thickness measurement module configured to measure a thickness of the film while the substrate is being conveyed before the polishing. The apparatus further includes a controller configured to control the polishing of the film by the polisher based on the thickness measured by the thickness measurement module.

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

A polishing apparatus according to an embodiment includes a polishing pad including a polishing surface for polishing a polishing target object and a membrane including a contact surface that is in contact with the polishing target object on the opposite side of the polishing surface. The contact surface is deformed from a flat surface into an uneven surface in response to pressure applied to the membrane.

Polishing apparatus

In one embodiment, a semiconductor manufacturing apparatus includes a polishing table configured to hold a polishing pad, a polishing head configured to hold a substrate to be polished by the polishing pad, and a polishing liquid feeder configured to feed a polishing liquid to the polishing pad. The apparatus further includes a heat exchanger configured to be placed on the polishing pad and control temperatures of the polishing pad and the polishing liquid, and one or more protruding portions provided on a side face or a bottom face of the heat exchanger.

A semiconductor manufacturing apparatus according to the present embodiment has a polisher polishing a substrate. A holder holds the substrate and rotates the substrate with respect to the polisher while pressing the substrate toward the polisher. A supplier supplies a polishing solution onto the polisher. A first annular part is attached to the holder. The first annular part is located around the substrate and between the holder and the polisher, when polishing the substrate. A second annular part is attached to the holder. The second annular part is located around the first annular part and between the holder and the polisher, when polishing the substrate. The first annular part is movable relative to the second annular part or the second annular part is movable relative to the first annular part, in a rotation direction of the substrate or the holder.

Semiconductor manufacturing apparatus and manufacturing method of semiconductor device

According to one embodiment, there is provided a cleaning apparatus including a substrate cleaner and a member cleaner. The substrate cleaner has a substrate cleaning member placed over a first region to be opposite a substrate and a second region different from the first region. The member cleaner is placed adjacent to the second region.

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Yokkaichi, Japan

Jun Takagi