Semes Co., Ltd.

Jun Taek Koo

Dong-Hun Kim

Wan Jae Park

Dong Sub Oh

Seong Gil Lee

Young Je Um

Myoung Sub Noh

Da Jeong Kim

Ye Rim Yeon

Mi Young Jo

A substrate treating method includes a temperature stabilizing step for stabilizing a temperature of the substrate to a process temperature in a treating space for treating a substrate, a pressure stabilizing step for stabilizing a pressure of a plasma space for generating a plasma and a pressure of the treating space to a process, the plasma space fluid communicating with the treating space, and a treating step for generating the plasma at the plasma space and treating the substrate using the plasma.

Substrate treating method and substrate treating apparatus

An embodiment of the present invention provides a substrate cleaning method including: supplying of a liquid cleaning solution containing a thermoreactive polymer resin in a solvent to a substrate; trapping of particles by gelling the liquid cleaning solution by phase transition through first heat treatment; liquefying of the gel-state cleaning solution with the particle trapped therein by phase transition through second heat treatment; and removing of the liquefied cleaning solution by supplying a rinse solution.

Method and apparatus for substrate cleaning

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Seoul, South Korea

Jun Taek Koo