Jx Nippon Mining Metals Corporation

Nippon Mining & Metals Co., Ltd.

Jun Suzuki

Toru Imori

Akihiro Aiba

Toshifumi Kawamura

Ryu Murakami

An electroless plating pretreatment agent that can retain stably Pd(II) over a long period of time in an organic solvent, an electroless plating method using the same that is capable of forming an electroless plated film having excellent adhesion, and an electroless plated object. The electroless plating pretreatment agent contains an organic palladium compound and a coordination compound having a functional group with a metal-capturing capability dissolved in an organic solvent, the coordination compound being selected from the group consisting of the imidazole analogs, polyethyleneamines, ethyleneimines and polyethyleneimines.

Electroless plating pretreatment agent, electroless plating method using same, and electroless plated object

The object of the present invention is to provide a pretreating agent for electroless plating that is stable and soluble in organic solvents, a method of electroless plating with excellent adhesiveness using it and an electroless plated product. An object to be plated is pre-treated using a pretreating agent for electroless plating comprising a noble metal soap of naphthenic acid or a fatty acid having 5 to 25 carbon atoms or preferably using a pretreating agent for electroless plating additionally comprising an imidazole silane coupling agent or other silane coupling agent having metal capturing ability, and then electroless plated. The noble metal soap is preferably a palladium soap.

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Kitaibaraki, Japan

Jun Suzuki