Korea Institute of Science and Technology

P.i., Inc.

Jun-Sik Cho

Seok-Keun Koh

Young-Gun Han

Young-Whoan Beag

Young-soo Yoon

Won-Kook Choi

Hyung-Jin Jung

Seok-Kyun Song

Disclosed is a method of forming an ITO film by optimized sequential sputter deposition of seed and bulk layers having different sputter process conditions, which is applicable to various display devices, and more particularly, to an organic light-emitting device needing an ultra-planarized surface roughness. In forming a transparent conducting electrode of a display device on a transparent substrate with an ITO film including a seed layer and a bulk layer, a method of forming the ITO film includes a first sputter deposition step of forming the ITO film on the substrate with sputtering gas supplied to an ion source at an ambience of oxygen flowing in the vicinity of the substrate and a second sputter deposition step of forming the ITO film with the sputtering gas supplied to the ion source only, wherein the first and second sputter deposition steps have different process conditions, respectively and wherein the seed and bulk layers are deposited by the first or second sputter deposition step.

Method of forming ITO film

A method of depositing indium oxide or indium tin oxide thin film on a polymer substrate is disclosed. In the method, oxygen or argon ion beam is radiated on a polymer substrate by a constant accelerating energy in a vacuum state to modify the surface of the polymer substrate, on which an IO thin film or an ITO thin film is deposited while oxygen ion beam, argon ion beam or their mixture ion beam is being radiated in a vacuum state. In addition, ion beam is generated from a cold cathode ion source by using argon, oxygen or their mixture gas and sputtered at a target substance composed of In O or In O and SnO , thereby an IO or an ITO thin film can be deposited on the surface-modified polymer substrate.

Method for pretreating a polymer substrate using an ion beam for subsequent deposition of indium oxide or indium tin oxide

The present invention relates to a process for modifying a polymer surface by irradiating ion particles with energy on a polymer surface, while blowing the reactive gas directly on the polymer surface under vacuum condition, to decrease the wetting angle of the polymer surface. The process for modifying the polymer surface according to the present invention can be widely used in the application fields of polymers because it provides effects of increasing the spreading of aqueous dyestuffs, increasing adhesive strength with other materials and inhibition of light scattering by decreasing the wetting angle of the polymer surface.

Process for modifying surfaces of polymers, and polymers having surfaces

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Seoul, South Korea

Jun-Sik Cho