Air Water Inc.

Jun Shimomura

Satoshi Ibaraki

Naoto Yoshinaga

Yoshiharu Wakayama

Yoshimi Murage

Niro Shiomi

Takaomi Ikeda

Yoshinobu Kodani

Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 &#x3bc;m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor

Disclosed is a thermofusible and thermosetting phenol resin powder having an average particle diameter of not more than 20 &#x3bc;m and a single particle ratio of not less than 0.7. This phenol resin powder preferably has an average particle diameter of not more than 10 &#x3bc;m, a variation coefficient of the particle size distribution of not more than 0.65, a particle sphericity of not less than 0.5 and a free phenol content of not more than 1000 ppm. Also disclosed are a dispersion liquid of such a phenol resin powder, and a method for producing a phenol resin powder having such characteristics.

Phenol resin powder, method for producing the same, and phenol resin powder dispersion liquid

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Hofu, Japan

Jun Shimomura