Lg Innotek Co., Ltd.

Samsung Electronics Co., Ltd.

Kookmin University

Industry-university Cooperation Foundation of Korea Aerospace University

Other

Lg Innotekco., Ltd.

Kookmin University Industry Academy Cooperation Foundation

Jun Seok Park

Wan Ho Kim

Won-Kyu Kim

Seok Hoon Kang

Won-Jae Jung

Ho Jin Lee

Jae-Hong Park

Yun Kyo Cho

Jin Ook Song

Yong-hark Shin

Hee-Jeing Park

Woongchul Choi

Chi Man Yu

Do Yang Jung

Hee Seok Moon

Jayil Jeong

Dong Wook Park

Yong Seok Choi

Kyung Phil Yoo

Jung Pil Lee

Hwa Seok Oh

Myung Sub Shin

Pil Yong Oh

Hyung Hwa Park

Jin Hyuk Kim

Han Sin

Jong Chul Park

Jee Hoon Sung

Dal Ahn

Sung Ho Hwang

Chul Sang Yoon

Kyu Hyun Nam

Won Churi Zoo

Won Jun Kwak

Nam Pyo Hong

Jong Soon Park

Jae Sung Yoon

Dae Hoon Jang

Yong-Hark Shin

A frequency multiplier is provided. A harmonic generator of the frequency multiplier comprises: a harmonic generating core unit; a first resonant tank which is connected to a first output terminal and a second output terminal of the harmonic generating core unit; and a first feedback circuit which is connected to the first output terminal and the second output terminal of the harmonic generating core unit to change the effective resistance of the first resonant tank.

Frequency multiplier

A neural processing system includes a first frontend module, a second frontend module, a first backend module, and a second backend module. The first frontend module executes a feature extraction operation using a first feature map and a first weight, and outputs a first operation result and a second operation result. The second frontend module executes the feature extraction operation using a second feature map and a second weight, and outputs a third operation result and a fourth operation result. The first backend module receives an input of the first operation result provided from the first frontend module and the fourth operation result provided from the second frontend module via a second bridge to sum up the first operation result and the fourth operation result. The second backend module receives an input of the third operation result provided from the second frontend module and the second operation result provided from the first frontend module via a first bridge to sum up the third operation result and the second operation result.

Neural processing system

A light emitting device including a package body having a first cavity; an electrode having a first electrode and a second electrode in the package body; at least one light emitting chip on the first electrode; a resin material in the first cavity; and a lens on the package body and the at least one light emitting chip. Further, the first electrode and the second electrode are separated by the package body, the package body comprises a first stepped portion exposed between the first electrode and the second electrode, the first electrode comprises a second cavity, and the at least one light emitting chip is disposed on the second cavity of the first electrode.

Light emitting device package

A weighted finite-state transducer (WFST) decoding system is provided. The WFST decoding system includes a memory that stores WFST data and a WFST decoder including a data fetch logic. The WFST data has a structure including states, and arcs connecting the states with directivity. The WFST data is compressed in the memory. The WFST data includes body data, and header data including state information for each states that is aligned discontinuously. The body data includes arc information of the arcs that is aligned continuously. The state information includes an arc index of the arcs, a number of the arcs, and compression information of the arcs, and the data fetch logic de-compresses the WFST data using the compression information, and retrieves the WFST data from the memory.

WFST decoding system, speech recognition system including the same and method for storing WFST data

There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increase.

Package for light emitting device and method for packaging the same

A light emitting device package can include a base including a flat top surface; first and second electrical circuit components disposed on the flat top surface of the base; a light emitting diode disposed on the flat top surface of the base, an optical member comprising a light transmissive material; and a guiding member disposed on the flat top surface of the base and having a closed loop shape for guiding the optical member, in which the first and second electrical circuit components respectively include first and second portions disposed between the flat top surface of the base and a bottom surface of the guiding member, the first electrical circuit component includes a first extension portion that extends from the first portion to a first location outside of an outer edge of the guiding member in a first direction, and a second extension portion that extends from the first extension portion to a second location outside of the outer edge of the guiding member in a second direction different than the first direction, the first direction and the second direction being disposed on a horizontal plane parallel to the flat top surface of the base.

Light emitting package having a guiding member guiding an optical member

A light emitting device package can include a base including a flat top surface; first and second electrical circuit layers on the flat top surface; a light emitting diode on a region of the flat top surface; an optical member to pass light; and a guiding member having a closed loop shape surrounding the region for guiding the optical member, in which the first and second electrical circuit layers respectively include first and second portions disposed between the flat top surface and a bottom surface of the guiding member, in which the first and second electrical circuit layers respectively include first and second extension portions that respectively extend from the first and second portions to locations outside of an outer edge of the guiding member in different directions.

A light emitting device package is provided. The light emitting device package includes a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

Light-emitting device package including lead frame and using lead terminal as a reflective cavity

In one embodiment, provided is a connector comprising: a body; a first protrusion formed on a first surface of the body; a first groove formed on the first surface of the body to be adjacent to the first protrusion, and of which the shape includes the inverse of the first protrusion; a first terminal of which at least a portion is arranged to correspond to the first protrusion; and a second terminal of which at least a portion is arranged to correspond to the first groove.

Connector, circuit board module and circuit board module array including same

A light emitting device module including a first and second lead frames, a light emitting device electrically connected to the first and second lead frames, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer, a resin layer surrounding the light emitting device, a PSR (photo solder resist) layer disposed between the first and second lead frames and the second lead frame and a sidewall disposed at the peripheral area of the light emitting device and including an inclined plane formed on at least one side surface thereof.

Light emitting device module

A light emitting device package including a base including a top flat surface; an insulating layer on the base; a light emitting diode on the base; an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough; a guiding member to guide the optical member, the guiding member having a ring shape; an electrical circuit layer electrically connected to the light emitting diode, the electrical circuit layer including an electrode portion and an extended portion, the electrode portion disposed inside the guiding member and electrically connected to the light emitting diode, the extended portion extended from the electrode portion to outside the guiding member; and an electrode layer on the electrode portion of the electrical circuit layer and electrically connected to the light emitting diode.

Disclosed are a light unit and a display apparatus including the same. The light unit includes a lens including a flat light incident part having a pattern and a light exit part, a plurality of light emitting devices below the incident part of the lens, and a substrate having the light emitting devices mounted thereon.

Light unit and display apparatus having the same

An embedded multimedia card (eMMC) and a method of operating the same are provided. The eMMC includes a flash memory and a device controller configured to control the flash memory. The device controller includes a command storage unit configured to receive a command transmitted from a host regardless of a state of a data bus and to store task information by task ID; and a status storage unit configured to store status information based on task status by task ID.

Embedded multimedia card and method of operating the same

Growing community of inventors

Gwangju, South Korea

Jun Seok Park