Hitachi, Ltd.

Jun Sasaki

Jun Yamada

Akitsuna Yuhara

Tetsuya Hirashima

Hiromi Isomae

Shozi Kawakubo

A SAW device having a piezoelectric substrate and interleaved metal electrodes formed on the substrate, in which the formation of the electrodes on the substrate is carried out by sputtering. Further, the metal electrodes may contain an additive of Cu, Ti, Zn, Mg, Fe, Ni, Cr, Ga, Ge, Sn, Pd or Ta. The resulting SAW device is capable of dealing with high frequency electric signals of a larger amplitude, or higher power electric signals, as compared with the conventional SAW device.

SAW device

In a SAW device comprising a piezoelectric substrate and at least one set of metallic electrodes formed on the piezoelectric substrate, at least one set of the electrodes have a laminated structure comprised of a layer of an aluminum film added with an impurity at a concentration of 6 wt. % or less and another layer of a film of pure aluminum or aluminum added with an impurity at a concentration of 0.4 wt. % or less. The SAW device having the laminated structure of electrodes can handle high frequency electric signals of higher power and/or larger amplitudes.

Growing community of inventors

Sagamihara, Japan

Jun Sasaki