Murata Manufacturing Co., Ltd.

Omron Corporation

Nissha Co., Ltd.

Rohm Co., Ltd.

Murata Manufactruing Co., Ltd.

Jun Sasaki

Noboru Kato

Satoshi Ishino

Katsumi Taniguchi

Nobuo Ikemoto

Teppei Miura

Shigeru Tago

Satoshi Sasaki

Takahiro Baba

Kuniaki Yosui

Chuzo Taniguchi

Kazuhiro Tsutsui

Masahiro Ozawa

Junichi Kurita

Kosuke Yamada

Hiroyuki Kubo

Naoki Gouchi

Kosuke Nishino

Eiji Kawashima

Nobuhito Tsubaki

Junichi Shibata

Ryomei Omote

Yuki Wakabayashi

Ayaka Miyake

Yasunori Kawamura

Hirofumi Shinagawa

Yoshihiro Sakata

Bunta Okamoto

Wataru Tamura

Yoshihito Otsubo

Takashi Noma

Norio Sakai

Harufumi Mandai

Masahiro Kinoshita

Ken Tonegawa

Ryota Yamada

Naoki Gochi

Jerry Hsieh

Fumie Matsuda

Isamu Morita

Atsushi Kumano

Masaru Terashita

Yasuko Yoshinaga

Tatsuo Ito

Hiroyuki Harimochi

Tomoya Bando

Sadayuki Matsumura

Yoichi Saito

Keisuke Araki

Daichi Hama

Yoshihiro Yoshimoto

Yasuisa Takinishi

Yoshiaki Mimura

Tatsuya Koga

Toshifumi Kurosaki

Shohei Morimoto

Kazuhiro Ikemoto

Norihiro Shimada

Kenji Okumura

Hiroaki Tsumori

Naohiro Kawai

Kenichiro Suzuki

Shintaro Wada

Noboro Kato

Junishi Kurita

Nobuo Kubosaki

Hiroomi Onda

Shun Tanaka

Shuichi Goto

Yuki Muto

Ai Miyabayashi

Keisuke Kihara

Nobou Ikemoto

Keisuke Tsuji

Franco Vernaroli

Yoshitomo Tanaka

Fabio Mangiapelo

Francesco Greco

Zhujun Yang

Yasutaka Okada

A resin housing having an electronic component and a method for manufacturing the same are disclosed. The resin housing includes an electronic component mounting film that includes a housing made of resin, a base film disposed along an inner surface of the housing, a circuit pattern layer formed on at least a surface opposite to a side of the housing of the base film, and an electronic component connected to the circuit pattern layer and mounted on a surface opposite to the side of the housing of the base film. The electronic component mounting film is integrated with the housing. An impact absorbing layer covers the electronic component of the electronic component mounting film and a periphery of the electronic component. The circuit pattern layer of the electronic component mounting film is not bent around a portion on which the electronic component is mounted.

Electronic component-equipped resin casing and method for producing same

A first groove is formed in a first main surface of a light guide member. A decorative layer is molded with the light guide member and provided on a second main surface of the light guide member. The decorative layer includes a first light-emitting portion that radiates the visible light emitted from a first light-emitting element from the light guide member and a second light-emitting portion that radiates the visible light emitted from the second light-emitting element from the light guide member. The first light absorbing member is disposed on a first groove bottom of the first groove, and has an absorptivity of visible light, which is higher than that of the light guide member. The first groove is positioned to block an optical path from the first light-emitting element toward a second region and an optical path from the second light-emitting element toward a first region.

Display device and method for manufacturing display device

A molded article or an electrical product facilitates layout of a wiring line from an electrical circuit of a circuit film integrally molded with a molded body to a connection terminal. The molded article includes a circuit film and a molded body. The circuit film includes an insulating film and an electrical circuit. The molded body is integrally molded with the circuit film. The circuit film includes a flexible wiring portion. The molded body has a through-hole that penetrates from a first main surface to a second main surface. In the flexible wiring portion, a connection terminal is arranged at a position of passing through the through-hole and beyond the second main surface.

Molded article, electrical product and method for producing molded article

An illumination display panel that forms part of a housing and has a display portion for illuminated display comprises a resin panel having a first molded portion made of an opaque resin at a portion excluding the display portion, and a second molded portion disposed on the back surface side of the first molded portion and made of a light-transmitting resin having a protrusion where the first molded portion is not present. The protrusion is fitted to the first molded portion. A light source mounting substrate is disposed on the back surface side of the resin panel. At least a light source of the light source mounting substrate is sealed by the second molded portion. An integrally molded product of the light source mounting substrate and the second molded portion is filled and solidified at a low pressure while compressing a cavity of a molding mold.

Illumination display panel and method of manufacturing the same

The present disclosure provides a foam molded product and a manufacturing method. The foam molded product is includes a foam body, an insert material having a display unit or a detection unit attached to the foam body, and a surface material affixed to a surface to which at least the insert material is attached. A manufacturing method includes: preparing a pair of molds including a first mold and a second mold; affixing an insert material and a surface material together such that the surface material is in contact with a molding surface of the first mold; closing the pair of molds; injecting a foam resin into a molding space formed by closing the molds; foaming the foam resin to form a foam body; opening the pair of molds; and removing a molded product in which the affixed part and the foam body are integrated.

Foam molded product and manufacturing method therefor

A switch cap for a switch device that can reduce a pressing error of a switch is provided. A three-dimensional first cap main body moves by a force applied to a first abutting portion from a finger which is an operator. A first sensor is disposed in the first cap main body, and detects abutting or approach of the finger to the first abutting portion. A first transmission member is fixed to the inside of the first cap main body, and moves together with the first cap main body for first switching to transmit movement of the first cap main body to a push button which is a predetermined location of a switch device. A first sensor is formed in a flexible printed circuit board (FPC) disposed in the first cap main body, and the FPC is fixed by the first transmission member and the first cap main body.

Method of manufacturing switch cap, switch cap, and switch device

Provided is a sheet-like device suitable for a flexible electrical product that is robust, highly flexible, and operates stably. The sheet-like device includes a first part where a first film layer, a first conversion unit, and a second film layer overlap, a second part where the first film layer is absent and the second film layer is present, and a third part where the first film layer, a second conversion unit, and the second film layer overlap. The first part the second part, and the third part are arranged side by side in this order in a first direction. A first region including the first part the second part, and the third part has an elongation per unit length greater than an elongation per unit length of the first film layer alone when a same force is applied in the first direction at 20° C.

Sheet-like device and manufacturing method of the same

The contact switching device includes a first terminal, a first contact, a second terminal, and a base. The first contact is attached to the first terminal. The base includes a first attachment portion, a second attachment portion, and a groove portion. The first terminal is attached to the first attachment portion. The second terminal is attached to the second attachment portion. The groove portion is arranged between the first attachment portion and the second attachment portion. The groove portion has a shape in which the inside is larger than the entrance.

Contact switching device

A module includes a multilayer body that includes insulating-resin base members laminated together, first and second main surfaces, and first and second regions when viewed in plan view. A first conductor pattern and a protective film that covers the first conductor pattern are provided in the first region of the first main surface. Second conductor patterns and holes that extend to the second conductor patterns are provided in the second region of the multilayer body. The holes are provided with conductive joining materials, and connectors are connected to the second conductor patterns by the conductive joining materials.

Resin multilayer substrate, transmission line, module, and method of manufacturing module

An operation analysis apparatus includes: an acquisition unit configured to acquire a plurality of pieces of operation information indicating operations of a plurality of persons to be analyzed; a classification unit configured to classify the plurality of pieces of operation information into a plurality of groups; and an analysis unit configured to analyze the operations of the persons to be analyzed based on the pieces of operation information that have been classified into the plurality of groups. The plurality of pieces of operation information each include skeleton information that indicates positions of a plurality of body parts that are associated with the skeleton of each of the plurality of persons to be analyzed, and the classification unit classifies the plurality of pieces of operation information using the skeleton information included in the operation information.

Operation analysis apparatus, operation analysis method, operation analysis program, and operation analysis system

An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.

Electronic apparatus

A contact mechanism includes: a movable touch piece that includes a caulking portion, a pair of arms forked from the caulking portion and respectively having free ends, first and second movable contacts provided at the respective free ends of the pair of arms, and a coupler configured to couple the free ends of the pair of arms; and first and second fixed contacts disposed respectively facing the first and second movable contacts contactably to or separably from the first and second movable contacts.

Contact mechanism and an electromagnetic relay provided therewith

An electrical element includes a flexible antenna and a rigid member higher in rigidity than the flexible antenna. At least one of the flexible antenna and the rigid member is made of thermoplastic resin. A conductor pattern defining at least a portion of a section that performs the main function of the electrical element is provided at the flexible antenna. No conductor pattern that performs the main function of the electrical element is provided at the rigid member. Opposing surfaces of the flexible antenna and the rigid member are directly joined to each other.

Electrical element, mobile device, and method for manufacturing electrical element

A manufacturing method for a camera module including a multilayer body in which an image sensor IC and a lens are arranged with an optical path provided in the multilayer body being disposed therebetween includes a first step and a second step. In the first step, the multilayer body is formed by stacking and combining flexible sheets. In the second step, a through hole is formed in flexible base material layers that constitute a portion of the multilayer body to form the optical path defined by the through hole.

Manufacturing method for camera module

Growing community of inventors

Nagaokakyo, Japan

Jun Sasaki