Sanyo Electric Co., Ltd.

Kanto Sanyo Semiconductors Co., Ltd.

Sanyo Semiconductor Co., Ltd.

Jun Sakano

Yusuke Igarashi

Noriaki Sakamoto

Kouji Takahashi

Nobuhisa Takakusaki

A circuit device of the present invention includes a wiring board, and circuit elements such as semiconductor elementsmounted on the wiring board. The wiring boardincludes: a conductive pattern, which is a metal core layer; a first insulating layerand a second insulating layerrespectively covering an upper surface and a lower surface of the conductive pattern; and a first wiring layerand a second wiring layerformed respectively on an upper surface of the first insulating layerand a lower surface of the second insulating layer. The conductive patternis made of rolled metal. With this configuration, the thermal resistance of the conductive pattern, which is the metal core, is reduced, and the thermal dissipation of the entire device can be improved.

Metal core circuit element mounting board

A method of manufacturing a circuit device includes the steps of preparing a conductive foil, forming conductive patterns in convex shapes by forming an isolation trench on a surface of the conductive foil, covering the surface of the conductive foil with a resin film so as to form the resin film covering the isolation trench thicker than the resin film covering upper surfaces of the conductive patterns, exposing the upper surfaces of the conductive patterns out of the resin film by removing the resin film, electrically connecting the conductive pattern exposed out of the resin film to a circuit element, forming sealing resin to seal the circuit element, and removing a rear surface of the conductive foil until the conductive patterns are mutually isolated.

Circuit device and manufacturing method thereof

To make thin a circuit devicein which are incorporated a plurality of types of circuit elementsthat differ in thickness, first conductive patterns, onto which comparatively thin circuit elementsA are mounted, are formed thickly, and second conductive patternsB, onto which comparatively thick second circuit elementsB are mounted, are formed thinly. Also, fine wiring parts may be formed using the thinly formed second conductive patternsB. Thus even in the case where thick circuit elements are incorporated, by affixing such circuit elements onto the thinly formed second conductive patternsB, the total thickness can be made thin. Thinning of circuit deviceas a whole can thus be accomplished.

Circuit device with conductive patterns separated by insulating resin-filled grooves

A circuit devicecomprises conductive patterns, separated by separation grooves, circuit elements, affixed onto conductive patterns, and an insulating resin, covering circuit elementsand conductive patternsand filling separation grooveswhile exposing the rear surfaces of conductive patterns. Constricted partsare formed at side surfaces of separation grooves. At constricted parts, the width of separation groovesis made narrower than at other locations. Thus by making insulating resinadhere closely to constricted parts, the adhesion of insulating resinwith conductive patternsis improved.

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Gunma, Japan

Jun Sakano