Samsung Electro-mechanics Co., Ltd.

Skc Co., Ltd.

Skc Solmics Co., Ltd.

Jun Rok Oh

Jin Cheol Kim

Tae Kyoung Kim

Min Soo Kim

Jong Hwi Park

Jung-Gyu Kim

Myung-Ok Kyun

Jung Doo Seo

Keun Yong Lee

Jonggab Baek

Ki Ryun Park

Geum Hee Yun

Hwa Young Lee

Seong Hyun Yoo

Sang Jun Yoon

Byoungsoo Kim

Gyu An Jin

Sung Sic Hwang

Kyung In Kim

Jae Bum Lee

Kyoung Yeol Min

Jung Kun Kang

A graphite sheet having a ratio of thermal diffusivity in horizontal and vertical directions of 300 or more is disclosed. Also, a graphite sheet having a ratio of thermal diffusivity in a vertical direction of 2.0 mm/s or less is disclosed. The graphite sheet has excellent thermal conductivity in horizontal and vertical directions and excellent flexibility at the same time and can be produced at low manufacturing cost, thereby holding an economic advantage.

Graphite sheet and method for manufacturing same

The present invention provides a graphite sheet having a ratio of thermal diffusivity in horizontal and vertical directions of 300 or more. Also, the present invention provides a graphite sheet having a ratio of thermal diffusivity in a vertical direction of 2.0 mm/s or less. The graphite sheet has excellent thermal conductivity in horizontal and vertical directions and excellent flexibility at the same time and can be produced at low manufacturing cost, thereby holding an economic advantage.

Provided are a composition for a semiconductor process, which comprises a first component comprising an inorganic acid or an organic acid; and a second component comprising a silicon compound represented by Formula 1, and a semiconductor process, which comprises selectively cleaning and/or removing an organic substance or an inorganic substance using the composition.

Composition for semiconductor process and semiconductor process

Disclosed herein is a composition for forming a substrate, comprising: a liquid crystal thermosetting oligomer having one or more soluble structural units in the main chain thereof and having thermosetting groups at one or more ends of the main chain thereof; and a metal alkoxide compound having reaction groups which can be covalently bonded with the thermosetting groups.

Composition for forming substrate, and prepreg and substrate using the same

Disclosed herein is a composition for forming a substrate, including: a compound prepared by polymerizing a liquid crystal thermosetting oligomer having one or more soluble structural units in a main chain thereof and having a thermosetting group at one or more of two ends of the main chain thereof with a fluorine compound having a functional group which can react with the main chain of the liquid crystal thermosetting oligomer.

A capacitor embedded printed circuit board (PCB) includes a multilayer polymer capacitor layer with a plurality of polymer sheets. One or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets, are alternately disposed to form a pair. A plurality of first extended electrodes and second extended electrodes protrude from the first inner electrodes and second inner electrodes, respectively. One or more insulating layers are laminated on one or both surfaces of the multilayer polymer capacitor. A plurality of first via holes for capacitor, and a plurality of second via holes for capacitor, penetrating the multilayer polymer capacitor layer are connected to the first extended electrodes and the second extended electrodes, respectively. The plurality of the first and second extended electrodes are alternately disposed to be opposite to each other.

Capacitor embedded printed circuit board

A method of manufacturing a chip capacitor according to an aspect may include: preparing a capacitor lamination including a dielectric sheet formed of a composite having ceramic powder and a polymer mixed with each other, and first and second internal electrodes formed on both surfaces of the dielectric sheet at predetermined intervals; forming covering layers formed of an insulating material on both surfaces of the capacitor lamination; forming a first opening and a second opening in the capacitor lamination having the covering layers formed thereon to expose the first and second internal electrodes, respectively; forming plating layers in the first and second openings, the plating layers connected to the first and second internal electrodes; and dicing the capacitor lamination into chips on the basis of the first and second openings so that the plating layers formed in the first and second openings are provided as first and second external terminals.

Method of manufacturing chip capacitor including ceramic/polymer composite

A method of manufacturing a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board manufactured by the method of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon.

Method of manufacturing printed circuit board including embedded capacitors

Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from &#x2212;300 to +300 ppm/&#xb0; C. in the temperature range of &#x2212;55&#x2dc;125&#xb0; C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.

Insulating material for printed circuit board

The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.

Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same

Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.

Growing community of inventors

Seoul, South Korea

Jun Rok Oh