Asm Technology Singapore Pte Ltd

Asmpt Singapore Pte. Ltd.

Jun Qi

Pingliang Tu

Yiu Ming Cheung

Kui Kam Lam

Zheng Chen

Chao Liu

Chun Hung Samuel Ip

Yong Wang

Ngai Tat Man

Ka Fai Fung

Chi Yung Lee

Yi Dong Du

Li Dong He

Pak Lun Cheng

Zhao Yang

Hao Meng

A dielectric barrier discharge plasma generator includes a ground electrode and a high voltage electrode which are configured to form a circuit to receive a power input for plasma generation, a dielectric barrier having a first surface attached to the high voltage electrode, and a second surface facing the ground electrode, and discharge gap being formed between the second surface of the dielectric barrier and the ground electrode for plasma generation, and a resiliently deformable mechanism operative to bias the high voltage electrode against the first surface of the dielectric barrier.

Dielectric barrier discharge plasma generator

When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.

Detaching a die from an adhesive tape by air ejection

A semiconductor die is bonded using epoxy onto a substrate supported on a heating platform. After preheating the substrate with the heating platform to a temperature of between 25&#xb0; C. and 60&#xb0; C., an epoxy dispenser deposits an epoxy dot onto the substrate before the semiconductor die is placed onto the epoxy dot with a pick head to thereby bond the semiconductor die onto the substrate.

Heating of a substrate for epoxy deposition

A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

Die attachment apparatus and method utilizing activated forming gas

Growing community of inventors

Hong Kong, China

Jun Qi