Tdk Corporation

Sony Group Corporation

T.rad Co., Ltd.

Jun Ono

Hiroyuki Tanaka

Atsushi Okubo

Makoto Koizumi

Nozomu Hachisuka

Yoshihiro Kudo

Yoshimitsu Wada

Nobutaka Nishio

Akira Komuro

Yoshihiko Sasaki

Tomohiko Ishida

Yasushi Shibata

The magnetic sensor of the invention comprises a base portion, a sensor chip positioned on the base portion, a wiring portion adapted to electrically connect a terminal of the sensor chip to a connecting lead, a resin having a low elastic modulus for coating at least the sensor chip, and a resin having a high elastic modulus for coating at least the low elastic-modulus resin and the wiring portion, wherein the sensor chip includes a magneto-resistive effect device, and the low elastic-modulus resin has an elastic modulus ranging from 10 kPa to 80 MPa while the high elastic-modulus resin has an elastic modulus of 1 GPa or more, and enables the sensor chip to perform well in a good state although having a structure of sealing up the sensor chip with the resin member.

Magnetic sensor

There are provided a light-receiving element for receiving light reflected from an optical recording medium, an optical head using the element, and an optical recording/reproducing apparatus using the element. In particular, the light-receiving element can be manufactured at low cost and in a simple manner and is configured to receive light from a short-wavelength laser source (having a wavelength of 402 nm to 413 nm). The light-receiving element includes a silicon substrate in which a light-receiving portion is formed; a circuit board for mounting the silicon substrate; at least one or more wires for electrically connecting the silicon substrate and the circuit board; a cover layer for covering the wires; and an exposed portion for exposing the light-receiving portion outside.

Light-receiving element, optical head using the same, and optical recording/reproducing apparatus using the same

Growing community of inventors

Tokyo, Japan

Jun Ono