Sharp Kabushiki Kaisha Corporation

Jun Okazaki

Mototaka Taneya

Masaaki Katoh

Takuya Shigenobu

Yohhei Yoshida

Tomotake Tanaka

A linear light source (), which emits light by causing light to propagate in a linear material () in which incoming light can be propagated, includes: a light emitting device (), provided on a side of one end of the linear material (), which emits light so that the light enters the one end of the linear material (); and a light receiving device (), provided on a side of the other end of the linear material (), which detects the light which has propagated in the linear material (). With the configuration, it is possible to provide: a linear light source in which an abnormal condition, such as breaking of a linear material, can be detected; and an electronic apparatus including the linear light source.

Linear light source and electronic apparatus

A light emitting device includes a semiconductor laser chip which emits a laser beam; a coherence reducing member which receives the laser beam and reduces coherence of the laser beam to generate a lower coherence light beam; and a package which houses the laser chip and the coherence reducing member, the package having an opening; wherein the laser beam emitted from the laser chip is converted into a lower coherence light beam by the coherence reducing member, and the lower coherence light beam is outputted through the opening.

Light emitting device

A chip-type LED including a LED element and a tubular vessel accommodating the LED element therein, wherein the vessel has an upper opening and a lower opening, the LED element is positioned between the upper opening and the lower opening such that the LED element emits light toward the upper opening, and the vessel is filled with a light-transmissive resin from the upper opening to the lower opening.

Chip-type LED and process of manufacturing the same

On an insulating substrate through which a plurality of through holes are formed, the following components and members are provided: LED chips, each of which consists of a p-side semiconductor layer and an n-side semiconductor layer that are joined into a p-n junction, and is placed between the adjacent through holes; a first electrode which is formed in one of the adjacent through holes, and connected to the p-side semiconductor layer so as to form electrical connections on the bottom surface of the insulating substrate; and a second electrode which is formed in the other adjacent through hole in a separate manner from the first electrode, and connected to the n-side semiconductor layer so as to form electrical connections on the bottom surface of the insulating substrate. Further, each through hole is sealed by a sealing member such as a conductive bonding agent. Moreover, the LED chips are sealed by a light-transmitting resin. With this arrangement, it is possible to easily mass-produce compact light-emitting devices with high reliability by cutting the insulating substrate along the through holes.

Method of making compact light-emitting device with sealing member

Compact light-emitting device with sealing member

Compact light-emitting device with sealing member and light-transmitting

A light emitting element having a cavity at the center of the top surface of an insulating block body. A through-hole extends downward through the block body to the bottom of the cavity. A metallic layer is present on the sides and bottom of the cavity, the sides of the through-hole, the bottom surface and part of the side surfaces of the block body. An LED chip is disposed on the metallic layer to the side of the bottom of the cavity. The LED chip and the metallic layer formed on a side of the bottom of the cavity separate from the first side are connected by a metallic wire. The cavity and the through-hole are filled with resin for encapsulating the LED chip.

Growing community of inventors

Nara, Japan

Jun Okazaki