Hitachi Zosen Corporation

Okuno Chemical Industries Co., Ltd.

Kanadevia Corporation

Jun Okada

Hiroaki Arai

Kyouichi Nakayasu

Yoshito Yamakawa

Hideyuki Niizato

Koji Kitamura

Masanori Goto

Satoshi Ashida

Hideki Shirota

Donghui Ma

A method of improving residual stress in a canister in which fuel assemblies are loaded includes, when the canister having a cylindrical canister shell and a canister lid welded to the upper opening of the canister shell is disposed in a cylindrical cask body, filling the space above and around an upper end portion of the canister in the cask body with fill water. Then, compressive stress is applied to a predetermined region of the upper end portion of the canister in the fill water. This makes it possible to readily apply compressive stress to the canister while shielding radioactive rays by the fill water.

Residual stress improvement method and residual stress improvement apparatus

To make it possible to raise a door body even if it is damaged by an impact of vehicle traffic or falling objects when it is in a lowered state, and to keep the door body in a raised state even if it is damaged by a water pressure of a tsunami or a high tide when it is in a raised state. A door bodyof a floating flap gateis disposed at an opening or at an access way. When water flows in, a forward endof which swings upwards, in a direction in which the water flows in and within a plane in a height direction, around a base endthereof which serves as a center of rotation, to block the opening or the access way. The door bodyis formed from a hard polyurethane foamin the form of a sheet.

Door structure for floating flap gate

A method of electroplating non-conductive plastic moldings, the method comprising the steps of: applying a catalyst useful for electroless plating to non-conductive plastic moldings using a colloidal solution containing a precious metal compound and a stannous compound; forming an electrically conductive coating on the surface of the moldings using an electroless copper plating solution containing a copper compound, a saccharide having a reducing property, a complexing agent and an alkali metal hydroxide; and electroplating the coated moldings. According to the method, an electroplated coating excellent in appearance and properties can be formed on non-conductive plastic moldings by a simple procedure.

Method of electroplating non-conductive plastic molded products

Growing community of inventors

Osaka, Japan

Jun Okada