Mitsui Chemicals, Inc.

Jun Okabe

Tadahiro Sunaga

Shizuo Tokito

Yugo Yamamoto

Setsuko Oike

Tomohito Sekine

Koji Yokosawa

A light, flexible, and tough thin film having high total light transmittance that can be formed on various three dimensional shapes, and also provides a stably driven tactile sensor, which is an electronic device having the switching function thereof, is provided. The tactile sensor is formed on a polyimide thin film having high total light transmittance, thermal resistance, and a polar component of surface free energy with a specific value, and has a switching device that emits a voltage signal which, through an electronic circuit for controlling noise, stably drives another device. This tactile sensor has a curved or flat surface and has a first electrode, a ferroelectric layer, and a second electrode formed over the polyimide thin film. The switching device as a tactile sensor can drive another device merely by a light touch with a finger, and can be manufactured at a high non-defective rate.

Tactile sensor formed on polyimide thin film having high total light transmittance, and switching device using same

Provided are an expandable or bendable circuit board having good body-contact feel, strong against bending and folding, and an electronic device made therefrom. The bendable circuit board includes: a film comprising a polyurethane synthesized by reacting a long-chain polyol with polyisocyanate and having a storage modulus at 25&#xb0; C. of 20 to 200 MPa, a tensile strength of 20 to 80 MPa, and an elongation at break of 500 to 900%, and the temperature of which the storage elastic modulus reaches to 1 MPa is at 155&#xb0; C. or higher; and circuit wiring formed in contact with a surface of the film. Alternatively, an expandable circuit board having the ratio &#x3c1;/&#x3c1;of the specific electrical resistance &#x3c1; of the circuit wiring when the circuit wiring is expanded to the specific electrical resistance (&#x3a9;&#xb7;cm) &#x3c1;of the circuit wiring before the circuit wiring is expanded is within a range of 1.05 to 10.0.

Bendable circuit board, expandable circuit board, and electronic device made therefrom

To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N&#x2014;H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa&#xb7;s, as measured by E-type viscometer at 25&#xb0; C. and 1.0 rpm.

Growing community of inventors

Ichihara, Japan

Jun Okabe