Taiyo Yuden Co., Ltd.

Jun Ogasawara

Toshimasa Suzuki

Keizo Kawamura

Youichi Mizuno

Jun Nishikawa

Nobuyuki Koide

A coil component includes: a substrate body having a first resin part formed by a resin that contains magnetic grains, and a second resin part joined to the surface of the first resin part and formed by a resin that contains filler, and whose resin content is higher than that of the first resin part; a coil embedded at least in a part of the first resin part and formed by a conductor having an insulating film; leader parts formed by the conductor and led out from the coil to the second resin part; and terminal parts connected electrically to the leader parts and provided in the second resin part. The above structures can enhance mechanical strength.

Coil component and electronic device

In an exemplary embodiment, a coil component includes: an element body partthat is formed containing a magnetic material; a coilthat is embedded within the element body partand constituted by a wound conductive wire; lead wiresthat are extended from the conductive wire and are led out from the coil; and terminal partsthat are joined to the lead wires; wherein tip partsof the lead wires, each having a prescribed length from the tip, are embedded in the element body partand also extend along the bottom faceof the element body part, and the terminal partsare joined to the tip partsof the lead wireson the bottom faceof the element body part

A coil component, adopted to be mounted on an electronic device, includes: an element body part; a coil fixed to the element body part and constituted by a wound conductive wire; lead wires that are each extended from the conductive wire and led out from the coil, and whose tip parts are each disposed a bottom face, which is a mounting face, of the element body part; and terminal parts that are each constituted by the tip part and a metal member that is joined to the tip part on the bottom face, and also has an opening at a position overlapping the tip part in a direction intersecting the bottom face.

A coil component includes: a substrate body having a first resin part formed by a resin that contains magnetic grains, and a second resin part joined to the surface of the first resin part and formed by a material that contains resin, and whose insulation property is higher than that of the first resin part; a coil embedded in the first resin part and formed by a conductor having an insulating film; leader parts formed by the conductor and led out from the coil to the second resin part; and terminal parts connected electrically to the leader parts; wherein covered parts of the leader parts, which are covered with the insulating film, are embedded partially in the second resin part, and the second resin part is disposed between the terminal parts and the first resin part, thereby preventing shorting between the terminal parts.

In an exemplary embodiment, a coil component includes: an element body part; a coilembedded within the element body partand constituted by a wound conductive wire; lead wiresthat are each extended from the conductive wire and led out from the coil, and whose tip partsare each fixed to a bottom faceof the element body part; and terminal partsthat are each constituted by the tip partorand a metal memberorthat is joined to the tip partoron the bottom face, and also has an openingorat a position overlapping the tip partorin a direction intersecting the bottom face

A multi-layer ceramic capacitor has a temperature characteristic satisfying an X8R property and has a high specific resistance under a high temperature circumstance, in which the dielectric ceramic composition forming the dielectric ceramics is expressed by a formula: BaTiO+aMgO +bMO+cReO+dSiO, wherein MgO represents MgO conversion, MOrepresents oxide conversion for 1 atom in 1 molecule of at least one metal selected from V, Cr, and Mn, ReOrepresents oxide conversion for 1 atom in 1 molecule of at least one rare earth metal selected from Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Y, and SiOrepresents SiOconversion, and wherein 0.4&#x2266;a&#x2266;3.0 mol, 0.05&#x2266;b&#x2266;0.4 mol, 6.0&#x2266;c&#x2266;16.5 mol, 3.0&#x2266;d&#x2266;5.0 mol, 2.0&#x2266;c/d&#x2266;3.3, based on 100 mol of BaTiO.

Dielectric ceramic composition, multi-layer ceramic capacitor and manufacturing method thereof

A ceramic capacitor has at least one dielectric layer and at least two electrodes having the dielectric layers therebetween. The dielectric layer includes a sintered body of ceramic grains containing a primary component of a perovskite crystal structure in a form of ABOand a ratio A/B of outer portions of the ceramic grains is greater than that of an inner portions thereof.

Ceramic capacitor and method for the manufacture thereof

A ceramic capacitor has at least one dielectric layer and at least two electrodes having the dielectric layers therebetween. The dielectric layer includes a sintered body of ceramic grains containing a primary component of a perovskite crystal structure in a form of ABO and a ratio A/B of outer portions of the ceramic grains is greater than that of an inner portions thereof.

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Takasaki, Japan

Jun Ogasawara