The Furukawa Electric Co., Ltd.

Fujitsu Corporation

Jun Niekawa

Naoki Kimura

Masaaki Yamamoto

Masami Ikeda

Ken Sasaki

Toshio Miyahara

Tatuhiko Ueki

Junji Yoshida

Toshio Kimura

Naoki Tsukiji

Naoya Yamazaki

Takeshi Aikiyo

Yasushi Kojima

Yuichi Kimura

Yoshio Nakamura

Hiroaki Maekawa

Osamu Kodachi

Masahiro Mogi

Hisao Enomoto

Kenichi Namba

Akira Iketani

A sealed plate type metallic heat pipe is disclosed having multiple independent through holes which run through the inside of the heat pipe. All of the through holes are connected in fluid communication at each end. A working fluid is disposed in the through holes and a wire or a wire mesh is disposed in at least one of the through holes.

Plate type heat pipe

In the semiconductor laser device of the present invention, a semiconductor stacked structure including an active layer comprising a strained multi-quantum well structure is formed on a substrate a cavity length is larger than 1000 &mgr;m but equal to or smaller than 1800 &mgr;m, and a low-reflection film S having a reflectance of 3% or less is formed on one facet and a high-reflection film S having a reflectance of 90% or more is formed on the other facet. The semiconductor laser module has a structure in which the semiconductor laser device is set to a cooling device constituted by electrically alternately arranging 40 pairs or more of the Peltier elements and holding them by top and bottom ceramic plates and sealed in the package. A grating having a reflection bandwidth of 1.5 nm or less is formed on an optical fiber to be built in.

Semiconductor laser device and semiconductor laser module using the same

A cooling system for an electronic device including a heat generating component within a case, wherein the heat generating component is installed on a bottom plate of the case, the bottom plate has a ventilating hole for air passage formed therein, and a foot portion installed outer surface of the case for maintaining a prescribed vertically opened space below the lower surface of the case.

Cooling system for electronic device

Electronic equipment housing

A flat type heat pipe for mounting a heating power element, which is capable of forming an optionally shaped heat transferring path with high accuracy, which is of a thin type and to which fins are easily attached. The flat type heat pipe includes at least two aluminum plates substantially in parallel with each other and brazed to each other so as to form a heat transferring path therebetween. The flat type heat pipe also includes an operating liquid which fills the heat transferring path. Because the heat transferring path is formed by means of press molding, punching, laser beam machining, or cutting various shapes of heat transferring paths can be formed finely and with high accuracy. The flexible flat type heat pipe can be made thin, which allows for a variety of uses. Grooves and wicks can be disposed in the heat transferring path, thereby improving the heat conductivity. Because the surface is flat, the fins can be easily attached thereto, thereby a satisfactory radiation effect can be obtained.

Flat type heat pipe

A heat-conductive rubber composition material, which comprises a rubber essentially consisting of an acrylic rubber, a butyl rubber, an ethylene propylene rubber or a blended rubber which comprises at least two of acrylic rubber, butyl rubber, and ethylene propylene rubber are blended, and 50 to 85 weight % of hydrophobic magnesium oxide powder, a heat-conductive rubber sheet prepared by forming the above thermal conductive rubber composition material, and a heat-conductive sheet, which comprises a soft metal sheet and a rubber layer formed on at least one surface of the soft metal sheet.

Heat-conductive rubber composition material and heat-conductive rubber sheet

The invention provides a cooling device provided with a heat pipe, which is capable of effectively radiating heat from electronic equipment such as a small-sized computer. The cooling device with the heat pipe comprises a plate-like container made of heat transferring metal for containing a working fluid, and having a heat absorbing surface larger than that of the body to be cooled, a the heat transferring metal column, and a hollow portion in which the working fluid exists. An alternating embodiment of the cooling device with the heat pipe comprises a plate-like container made of heat transferring metal, a heat absorbing wall having a large heat absorbing surface, and a plurality of protrusion portions.

Cooling device with heat pipe

There is provided a heat sink having excellent heat dissipation characteristics and mechanical reliability, which is used for motors for electric vehicles, control circuits therefor, internal combustion engines, general power control units, general motors, general semiconductors (CPUs, power modules, etc.), optical semiconductors and various electronic components, etc. The heat sink is configured so that an aluminum alloy layer is formed on at least one side or on both sides of a metallic plate shaped body and fins are formed on the aluminum alloy layer. Because the fins are formed on the aluminum alloy layer provided on the metallic plate shaped body, satisfactory thermal diffusion is effected in the metallic plate shaped body, and the thermal resistance between the metallic plate shaped body and the fin is low, so that the heat radiating effect is high, and the heat sink can be made small. Also, excellent and stable heat dissipation can be achieved for a long period of time.

Heat sink

The invention provides a cooling device with a heat pipe, which is capable of effectively radiating heat from electronic equipment such as a small-sized computer. The cooling device with the heat pipe comprises a plate-like container made of heat transferring metal for containing a working fluid, and having a heat absorbing surface larger than that of the body to be cooled, a heat transferring metal column, and a hollow portion in which the working fluid exists. An alternating embodiment of the cooling device with the heat pipe comprises a plate-like container made of heat transferring metal, a heat absorbing wall having a large heat absorbing surface, and a plurality of protrusion portions.

Growing community of inventors

Tokyo, Japan

Jun Niekawa