Hitachi, Ltd.

Other

Jun Nakazato

Seiji Ishikawa

Isao Miyazaki

Masao Sakata

Yuichi Ohyama

Yuzo Taniguchi

Sadao Shimoyashiro

Kazuhiko Matsuoka

Hiroto Nagatomo

Kimio Muramatsu

Tsutomu Okabe

Osamu Satou

Yuzaburo Sakamoto

Shuichi Hanashima

Taizo Hashimoto

Yutaka Ebara

Mari Nozoe

Yasuhiro Yoshitake

Kenji Watanabe

Masataka Shiba

Fumio Mizuno

Yoshiyuki Miyamoto

Toshimitsu Hamada

Seiji Isogai

Ikuo Suzuki

Yoshiharu Shigyo

Makoto Ariga

Masami Ikota

Terushige Asakawa

Hidekuni Sugimoto

Tetsuji Yokouchi

Kazuko Ishihara

A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

Process management system

The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Inspection data analyzing system

Process control system

The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

A semiconductor failure analysis system and method therefor facilitated by a failure information collection unit for collection, by bit, failure information of a semiconductor, an inspection unit for examining relations between various types of inspection data obtained by inspection of the semiconductor and for examining relations between the inspection data and failure information, a storage unit for storing design information of the semiconductor, an analysis unit for analyzing the failure information from the failure information collection unit, from the inspection unit and design information stored in the storage unit, a display unit for displaying at least one of the result of analysis from the analysis unit and the failure information, a failure cause estimation unit for estimating a cause of the failure information, and a unit for feeding the estimated cause of the failure information back to a process in which the failure has occurred.

Semiconductor failure analysis system

Inspection system and method using separate processors for processing different information regarding a workpiece such as an electronic device

A semiconductor failure analysis system which includes a failure information collection unit for collecting, by bit, failure information concerned with a failure of a semiconductor, an inspection unit for examining relations between various types of inspection data obtained by inspection of the semiconductor and for examining relations between said inspection data and the failure information, a storage unit for storing information concerned with design of said semiconductor, an analysis unit for analyzing the failure information on the basis of output information output from the failure information collection unit, output information output from the inspection unit and design information stored in the storage unit, a display unit for displaying at least one of the result of analysis output from the analysis unit and the failure information, a failure cause estimation unit for estimating a cause of said failure information, and an unit for feeding the estimated cause of said failure information back to a process in which the failure has occurred.

Growing community of inventors

Tokyo, Japan

Jun Nakazato