Tokyo Electron Limited

Jun Mochizuki

Hisatomi Hosaka

Kunihiro Furuya

Yoshihito Yamasaki

Hiroshi Yamada

Shigekazu Komatsu

Jun Fujihara

Takashi Amemiya

Takanori Hyakudomi

Hiroaki Hayashi

Shinichiro Takase

Shinya Kurebayashi

Miyoko Kuroda

Kanji Suzuki

There is provided a mounting table on which a substrate to be inspected is mounted. The mounting table comprises: a plurality of temperature sensors, each configured to measure a temperature of a corresponding one of a plurality of spots on the mounting table; and electrode pads, each connected to a corresponding one of the temperature sensors and installed on a mounting surface.

Mounting table, inspection device, and temperature calibration method

An intermediate connecting member according to one aspect of the present disclosure is provided between a first member including multiple first terminals and a second member including multiple second terminals. The intermediate connecting member includes multiple connection parts configured to electrically connect the first terminals to the second terminals, and a retainer holding the multiple connection parts. Each of the multiple connection parts is formed of an elastic member to which an electrically conductive property is given at least on a surface of the elastic member.

Intermediate connecting member and inspection apparatus

A pogo block includes: a conductor having a first terminal connected to a terminal of a board of an inspection part, a second terminal connected to a terminal of a probe card, and an elastically expandable and contractible connection portion connecting the first terminal and the second terminal, and configured to be expandable and contractible in a direction connecting the first terminal and the second terminal; and a housing having a first holder configured to hold the first terminal, a second holder configured to hold the second terminal, and a guider into which the elastically expandable and contractible connection portion is inserted and configured to guide movements of the first holder and the second holder in the direction connecting the first terminal and the second terminal.

Pogo block within the intermediate connection member of an inspection system

An electrical connecting device having one or more contact members to be in contact with a contact target is provided. The electrical connecting device includes a main body having one or more recesses on a surface thereof opposed to the contact target, and a flexible portion that covers the recesses to form sealed spaces. The main body includes a gas exhaust passage and an air supply passage provided for each of the sealed spaces to adjust a pressure in each of the sealed spaces, and the contact members are respectively disposed to be opposed to the recesses with the flexible portion interposed therebetween.

Electrical connecting device, inspection apparatus, and method for electrical connection between contact target and contact member

An inspection system includes an inspection device that includes a stage on which a substrate is mounted and inspects the substrate on the stage, a temperature adjustment mechanism that adjusts the temperature of the stage, a substrate accommodating part, a temperature measurement substrate standby part that makes a temperature measurement substrate wait, a transfer unit that transfers the substrate and the temperature measurement substrate onto the stage, and a camera used for aligning the substrate on the stage. The temperature measurement substrate includes, on the surface thereof, a temperature measurement member whose state changes depending on the temperature. The transfer unit transfers the temperature measurement substrate onto the stage, the camera images the temperature measurement member, and the temperature of the temperature measurement substrate is measured from a change in the state of the temperature measurement member.

Inspection system and temperature measuring method for inspection system

In a method for contact accuracy assurance in an inspection apparatus, an alignment substrate having first marks is placed and aligned on a stage, and a position checking member, which is a transparent body simulating a probe card and has second marks at positions corresponding to the first marks, is coupled to a mounting part where the probe card is to be coupled. Further, the alignment substrate is placed in a contact area directly below the position checking member. Horizontal deviations between the first and the second marks are detected by capturing images of the first and the second marks with position checking cameras provided above the position checking member at positions respectively corresponding to the second marks to capture the images from a top down angle. The contact accuracy between the substrate and probes of the probe card is assured when the deviations are within an allowable range.

Contact accuracy assurance method, contact accuracy assurance mechanism, and inspection apparatus

An inspection device for inspecting an inspection target substrate includes a probe card, a tester, a plurality of conductive lines, and a resistor. The probe card has probes to be in contact with the inspection target substrate. The tester is configured to transmit and receive electric signals for an inspection to and from the inspection target substrate through the probes. The conductive lines electrically connect the probe card with the tester, and at least a part of the conductive lines is electrically connected to the probes. The resistor is formed at the probe card and serves as an electrical resistor. The tester is further configured to measure a resistance of the resistor based on the electric signals transmitted and received through the conductive lines.

Inspection device and method of controlling temperature of probe card

A temperature measurement member measures a temperature of an inspection object or a temperature of a mounting table on which the inspection object is placed inside an inspection apparatus that inspects the inspection object. The temperature measurement member is attached to an attachment position of a probe card used for electrical characteristic inspection in the inspection apparatus, and includes a main body having substantially a same shape as the probe card; a probe formed to extend from the main body toward the mounting table in a state in which the temperature measurement member is attached to the attachment position; and a temperature sensor configured to measure the temperature of the inspection object or the mounting table. The sensor transmits/receives a temperature measurement-related electrical signal to/from an inspection part via the probe card in the electrical characteristic inspection, and transmits a temperature measurement result to the inspection part.

Temperature measurement member, inspection apparatus, and temperature measurement method

There is provided an intermediate connection member provided between a first member having a plurality of first terminals and a second member having a plurality of second terminals to electrically connect the plurality of first terminals and the plurality of second terminals, respectively. The intermediate connection member includes: a block member including connection members configured to electrically connect the plurality of first terminals and the plurality of second terminals, respectively; a frame member having an insertion hole into which the block member is inserted; and an electronic component electrically connected to one of the connection members.

Intermediate connection member and inspection apparatus

A method of contacting a substrate with a probe card in a substrate inspection apparatus can inspect electrical characteristics of semiconductor devices on the substrate. A wafer W is transferred to a position facing a probe cardwhile being mounted on a chuck memberwith a wafer platetherebetween, and electrodes of semiconductor devices on the wafer W are contacted with probes of the probe cardby moving the wafer W and the wafer platetoward the probe cardthrough an elevating device. Then, the wafer W is overdriven toward the probe cardand a contact state between the electrodes of the semiconductor devices and the probes of the probe cardis maintained by decompressing a space S between the probe cardand the wafer plate. Then, the chuck memberis separated from the wafer plate

Method of contacting substrate with probe card

A support body for a plurality of contact terminals included in a probe card for inspecting semiconductor devices formed in a semiconductor substrate is provided. The support body includes a main body formed by stacking a plurality of plate-shaped members, a plurality of contact terminal holes formed through the main body in a thickness direction of the plate-shaped members, and one or more coolant paths provided in the main body. Further, the contact terminals respectively are inserted into the contact terminal holes.

Support body for contact terminals and probe card

A contact structure for inspection that is installed on a bottom surface of a circuit board includes a ground conductor that is grounded; an elastic contact member that is brought into contact with an inspection target object; and a conductive line that electrically connects the circuit board and the elastic contact member. Here, the elastic contact member may be provided on a bottom surface of the ground conductor that is grounded. The elastic contact member may include an insulating layer, a wiring layer, a contactor and an elastic body provided at a position corresponding to the contactor. The elastic body provides the elastic contact member with elasticity when the contactor is brought into contact with an electrode. The elastic contact member is provided in parallel with the ground conductor. The wiring layer and the ground conductor form a microstrip line.

Contact structure for inspection

A manufacturing method for probe card according to the present invention includes following processes. A film is formed on the surface of a circuit board. A connecting terminal and joint member are formed by etching the film, and the surface of the joint member is polished. An inspection contacting structure is assembled. The inspection contacting structure is moved proximity to a circuit board. The lower surface of a contactor and joint member are attached so as to contact the front end of a probe penetrating and passing through the contactor to the connecting terminal.

Manufacturing method of probe card and the probe card

A plurality of metal plates and an insulating plate having a polished surface are laminated in a probe supporting plate. Through-holes into which probes are to be inserted are respectively formed in the metal plates and the insulating plate. Diameters of the through-holes are greater than diameters of the through-holes, and the through-holes pass through the probe supporting plate in a thickness direction of the probe supporting plate. Hollow portions passing through the probe supporting plate in the thickness direction of the probe supporting plate are formed in the probe supporting plate. Each of the hollow portions is formed by connecting each of holes formed in each of the metal plates and each of holes formed in the insulating plate. Diameters of holes of a metal plate that is an uppermost layer, holes of a metal plate that is a lowermost player, and holes of a metal plate that is one of intermediate layers are less than diameters of holes of metal platesthat are the other intermediate layers.

The present invention provides a probe card that can examine an object with small electrode spacing. A probe supporting plate is provided to a lower face side of a printed wiring board of a probe card. A plurality of probes are supported by the probe supporting plate. The probes comprise an upper contact, a lower contact, and a main body portion. An upper end portion of the upper contact protrudes toward an upper side of the probe supporting plate and contacts a terminal of the printed wiring board. A lower end portion of the lower contact protrudes toward a lower side of the probe supporting plate. On the probe supporting plate, a through-hole and a concave portion are formed to luck the probes, and the probes can be inserted and removed freely against the probe supporting plate from above.

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Nirasaki, Japan

Jun Mochizuki