The Furukawa Electric Co., Ltd.

Jun Miyokawa

Yuichiro Irie

Etsuji Katayama

Takeo Shimizu

Kazuki Yamaoka

Toru Fukushima

Takashi Koseki

Masakazu Miura

Toshio Kimura

Maiko Ariga

Kaoru Sekiguchi

Kiyokazu Tateno

Kazuya Nagashima

Atsushi Izawa

Takahiro Okada

Hajime Mori

Takeshi Aikiyo

Hidehiro Taniguchi

Yuta Ishige

Masaru Saito

Yozo Ishikawa

Taketsugu Sawamura

Tetsuya Matsuyama

Naoki Hayamizu

Akira Mugino

Toshio Sugaya

Toshio Mugishima

Kaoru Iida

Teruo Kusano

Hiroshi Kasahara

Taijiro Takase

An optical device includes: a case; a sleeve attached to the case, the sleeve including a first through-hole penetrating between an inside and an outside of the case, and an inclined surface inclined with respect to a penetrating direction of the first through-hole, the inclined surface having an opening of the first through-hole; a first optical fiber including a core wire including a core and a clad, and a sheath configured to surround the core wire, wherein an exposed portion of the core wire not surrounded by the sheath passes through the first through-hole; and a first joining material interposed and sealed between an outer peripheral surface of the exposed portion and an inner peripheral surface of the first through-hole in the first through-hole.

Optical device and method for manufacturing optical device

An optical module includes: an optical element; a housing configured to house the optical element; as electrical terminal arranged on an outer peripheral surface of the housing and electrically connected to an inside of the housing; and a positioning unit configured to determine a relative position of a wiring board electrically connected to the electrical terminal from outside of the housing, with respect to the electrical terminal.

Optical module and method of manufacturing optical module

Provided is a package for an optical device and an optical device module that can reduce or prevent damage occurrence in an optical fiber optically coupled to an optical device while ensuring a good airtightness. A package for an optical device includes a package main unit that accommodates an optical device; a pipe portion that is provided in the package main unit and through which an optical fiber optically coupled to the optical device is inserted; and a fixing portion that is provided in the package main unit and to which one end of the optical fiber is fixed, and the pipe portion includes a first pipe section having a base end fixed to the package main unit and a second pipe section joined to a tip of the first pipe section, having a higher thermal expansion coefficient than the first pipe section, to be sealed by a sealing material.

Package for optical device and optical device module

A flexible substrate has an insulating base member and a conductive layer that is formed on the base member and includes an electrical connecting portion fixed to a component and electrically connected to the component, and the flexible substrate includes: a main portion on which the electrical connecting portion is formed; and a protruding portion provided so as to protrude from a portion of the main portion in which the electrical connecting portion is formed, wherein the main portion is bent along a first bending line extending in a first direction, and wherein the protruding portion can be bent along a second bending line extending in a second direction intersecting the first direction and is adapted to reduce stress occurring at the electrical connecting portion by the protruding portion being bent along the second bending line.

Flexible substrate, flexible substrate-attached component, and manufacturing method of flexible substrate-attached component

A non-plated region is formed in a certain range from an end of a submount. The non-plated region is a portion where a plating layer is not provided, and thus a substrate of the submount is exposed. An intermediate layer is formed on the plating layer. Furthermore, a plating layer is formed on the intermediate layer. A semiconductor laser is formed on the plating layer. The position of an end of the semiconductor laser substantially coincides with the position of an end of the plating layer (the intermediate layer). That is, even in a case where there is a deviation between an end face of the intermediate layer and an end face of the semiconductor laser, the amount of this deviation is sufficiently smaller than the amount by which the intermediate layer is set back from an end face of the submount.

Optical coupling structure between optical fiber and semiconductor laser

A semiconductor laser module includes a semiconductor laser that outputs laser light; an optical fiber that guides the laser light; a lens that couples the laser light, which is output from the semiconductor laser, with the optical fiber; a base that is substantially tabular in shape and that has the semiconductor laser, the optical fiber, and the lens fixed thereon either directly or indirectly; and a housing which houses the base and fixes the base either directly or indirectly. Among faces of the base, a face on a side that is fixed either directly or indirectly to the housing includes a junction plane that is joined to the housing either directly or indirectly, and a detachment plane that is detached to remain unfixed from the housing.

Semiconductor laser module

An optical fiber fixing structure includes: a cylindrical member; an optical fiber inserted into a hole of the cylindrical member; and a fixing material configured to fix the cylindrical member and the optical fiber, wherein the optical fiber is a polarization maintaining optical fiber having a polarization axis, and a center of the optical fiber is arranged so as to be eccentric to a center of the hole, and an angle formed by an eccentric direction connecting the center of the hole and the center of the optical fiber and the polarization axis is &#x2212;22.5&#xb0; to 22.5&#xb0;, or 67.5&#xb0; to 112.5&#xb0;.

Optical fiber fixing structure

This fixing structure for an optical fiber comprises a groove provided to a fiber-fixing base along the axial direction of an optical fiber to be fixed. The groove opens upward. The optical fiber is arranged within the groove along the groove. The optical fiber is fixed to the inner surface of the groove using an adhesive. The inner-side surfaces of the groove that face each other serve as fixing surfaces for the optical fiber. In other words, the optical fiber is fixed to the fixing surfaces that are the inner-side surfaces of the groove and that face each other using the adhesive. A space in which the fiber-fixing base and the adhesive are not bonded is formed in the vertical direction of the optical fiber. In other words, a space is provided in a vertical direction that is substantially perpendicular to the fixing direction in which the optical fiber is fixed.

Fixing structure for optical fiber, semiconductor laser module, and fixing method for optical fiber

A semiconductor laser module includes: a semiconductor laser element emitting a laser light; an optical fiber, into which the laser light emitted from the semiconductor laser element is incident, guiding the laser light; and an optical-fiber-holding unit having a fixing agent and holding the optical fiber, the fixing agent being for fixing the optical fiber. The fixing agent is provided at an area in which a power of a leakage light of the laser light having been incident into the optical fiber and then emitted to outside the optical fiber is low.

The present invention provides a semiconductor laser module in which a coupling efficiency does not easily vary even though a displacement amount varies by the effect of welding. The semiconductor laser module comprises: a semiconductor laser elementfor emitting a laser light whose cross-sectional shape at an emission end face is elliptical; an optical fiberarranged to receive the laser light from the semiconductor laser element; a packagefor housing the semiconductor laser elementand the optical fiber; a first fastening meansfor fastening the optical fiberto the package; and a second fastening meansfor fastening the semiconductor laser elementto the package, wherein the semiconductor laser elementand the optical fiberare fastened such that a minor axis of the elliptical shape of the laser light becomes parallel to a line connecting both ends of the optical fiber, said both ends being restricted by the first fastening means

Semiconductor laser module and optical module

A light-emitting element mount () is fixed onto a base (), and a semiconductor laser element () is fixed onto the light-emitting element mount (). An anchor member (), which is in the shape of a roughly rectangular plate, is fixed onto the base (). An optical fiber () is fixed onto the anchor member () by means of an anchoring material (). The optical fiber () is aligned and optically coupled with the semiconductor laser element (). A cut-out () is formed in the part of the base () corresponding to the anchoring material () (below the anchoring material ()). Thus the anchor member () is fixed onto the base () so as to straddle the cut-out (). Since the cut-out () is formed below the anchor member (), a spot heater () or like can be used to heat the anchor member () from the bottom surface thereof. Thus, the anchoring material () on top of the anchor member () can be efficiently heated.

Semiconductor laser module and manufacturing method therefor

An optical semiconductor module including a base having installed on an optical fiber and an optical semiconductor element, and a package which houses the base on a bottom thereof and has a first side wall with an optical section through which the optical fiber is led and a second side wall facing the first side wall, where the base is cut off to form a curved surface with respect to the bottom at a lower corner on a side of the base facing the second side wall of the housing, and a ratio of r/t is from 0.4 to 1.0, where t is a thickness of the base, and r is a curvature radius of the curved surface.

Optical semiconductor module

An optical semiconductor module includes an optical semiconductor element; an optical fiber optically coupled with the semiconductor element; a base having an upper surface and a lower surface; and a package. The package has a bottom plate on which the base is mounted, a front wall having a hole through which the optical fiber is inserted, and a rear wall opposite to the front wall. The optical fiber and the optical semiconductor element are mounted on the upper surface. The base has a rear face formed on an end portion opposite to the front wall, and the rear face is positioned above the lower surface of the base.

An optical module includes a package; an optical device housed in the package, and having a temperature-dependent characteristic; a thermo-module connected to the optical device to control its temperature and configured to heat or cool the optical device when supplied with a first electric current in one direction or a second electric current in a direction opposite to the first electric current, respectively; and a heating element disposed close to the optical device and configured to heat the optical device when supplied with an electric current.

Growing community of inventors

Tokyo, Japan

Jun Miyokawa