Mitsubishi Chemical Corporation

Mitsubishi Plastics, Inc.

Jun Matsui

Shingetsu Yamada

Shuuji Suzuki

Masashi Ikeda

Yoshihito Sato

Tomohiko Terai

Nobuhiro Arai

Seiji Takagi

Toshiaki Ebitani

Toru Seo

Syuuji Suzuki

A laminate produced by laminating a plurality of materials having different linear expansion coefficients via an adhesive agent and is less liable to warp after the adhesive agent is heat-cured. The laminate has a structure including a first material, an adhesive agent layer, and a second material. The first material and the second material have different linear expansion coefficients, and the adhesive agent layer contains an adhesive agent having a warpage reduction index of not less than 30 as calculated from the following expression (1):Warpage reduction index=100−()×100  (1).

Laminate, production method therefor, and automotive exterior material

The invention provides a metal substrate and a light source device ensuring that a semiconductor chip working as a light source can be firmly joined by using a metal joining material, such that heat generated in the mounted semiconductor chip can be efficiently dissipated through a metal plate. The metal substrate includes a heat dissipating metal plate made of a metal except for Au, an insulating resin-made white film stacked on a part of the heat dissipating metal plate, and a light source mounting surface-forming layer stacked on another part of the heat dissipating metal plate. The metal substrate is such that the light source mounting surface-forming layer is a metal layer directly contacting the heat dissipating metal plate, and the light source mounting surface is a surface of an Au layer which is the outermost layer of the light source mounting surface-forming layer.

Metal substrate and light source device

Provided is a metal foil laminate that: has heat resistance; has high reflectance in the visible light range; has little decrease in reflectance in environments with a high-temperature thermal load; is compatible with large surface areas; and can be used for printed circuit boards for mounting LEDs that have excellent adhesion with metals. The metal foil laminate is characterized in that: a laminate has metal foil on at least one side of a resin layer (A) containing a polyorganosiloxane and an inorganic filler; the 90&#xb0; peel strength between said resin layer (A) and said metal foil is at least 0.95 kN/m, and the mean reflectance at wavelengths of 400 to 800 nm on the surface that is exposed when the resin layer (A) is exposed by peeling and removing said metal foil is at least 80%; and the decrease in the reflectance at a wavelength of 470 nm after being treated with heat for 10 minutes at 260&#xb0; C. is not more than 5%.

Metal foil laminate, substrate for mounting LED, and light source device

The present invention provides a white film comprising a thermoplastic resin composition containing 25-100 parts by mass of an inorganic filler based on 100 parts by mass of a thermoplastic resin, wherein the average reflectance at a wavelength of 400-800 nm is 70% or more, the average linear expansion coefficient in the machine direction and the transverse direction is 35&#xd7;10/&#xb0; C. or less, and the decreasing rate in reflectance at a wavelength of 470 nm after thermal treatment at 200&#xb0; C. for 4 hours is 10% or less; and the invention provides a metal laminated body. These exhibit high thermal resistance, high reflectance within visual light range, and small decrease in reflectance under a high heat load environment, but also be applicable for a large sized printed circuit boards for mounting LEDs.

Metal laminated body, LED-mounted substrate, and white film

Growing community of inventors

Nagahama, Japan

Jun Matsui