Kawasaki Microelectronics, Inc.

Jun Maeda

A semiconductor integrated circuit having connection pads arranged over active elements is disclosed. The connection pad is divided into a probing area and a bonding area, and reinforcing structures are formed separately under the respective areas. The reinforcing structure under the probing area is formed using a number of wiring layers less than the number of wiring layers used for forming the reinforcing structure under the bonding area. As a result, the wiring layers under the probing area are efficiently utilized to forms wires for realizing the logical function of the integrated circuit.

Semiconductor integrated circuit having connection pads over active elements

In an exemplary layout structure of a semiconductor integrated circuit manufactured by a photolithographic process using an exposing light having a wavelength &#x3bb;, a peripheral circuit region is formed by arranging a plurality of peripheral circuit cells, each having peripheral circuit patterns, along a side of an internal circuit region. A proximity dummy region is formed by arranging a plurality of proximity dummy cells, each having a proximity dummy pattern, along at least one side of the peripheral circuit region. The proximity dummy region includes a line-and-space repetition structure including, and having the regularity of, two or more pairs of lines and spaces between the lines every 8&#x3bb;. The repetition structure in the proximity dummy region reduces the dimensional deviation in the outermost portion of the peripheral circuit region.

Layout structure of semiconductor integrated circuit and method for forming the same

A plurality of standard cellsare arranged to form a channel-less standard cell array, which has vertical and horizontal sides. A plurality of first proximity dummy cellsare arranged along each of the vertical sides of the standard cell array to form a first proximity dummy bandssuch that the upper and lower sides of the first proximity dummy cells are in contact with each other and such that the left or right side of each of the first proximity dummy cells is in contact with the vertical side of the standard cell array. Furthermore, a plurality of second proximity dummy bands are arranged along each of the horizontal sides of the standard cell array to form a second proximity dummy bands such that the upper or lower side of each of the second proximity dummy cells is in contact with the horizontal side of the standard cell

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Mihama-ku, Japan

Jun Maeda