Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Jun Long

Tao Li

Hao Li

Wan-Lin Xia

Yong Zhong

A heat dissipation device for dissipating heat from an electronic component () mounted on a printed circuit board () includes a retention module () resting on the printed circuit board, a heat sink () disposed on the retention module for contacting the electronic component, a clip () for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (), a gasket () engaging with the back plate, and a bracket () being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks () contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.

Heat dissipation device having a back plate unit

A heat sink assembly includes a heat sink having a first shoulder and a second shoulder, and a locking device having a retention module, a first clip and a second clip. The first clip has two extension portions engaging with the retention module and a pressing portion between the two extension portions. The second clip comprises a pressing portion located on the second shoulder, an axle connecting with the pressing portion and pivotably engaging with the retention module and a locking portion connecting with the pressing portion. The second clip can rotate around the axle thereof when the heat sink assembly is in an unlocked position; the locking portion engages with the retention module and the pressing portion presses the second shoulder of the heat sink toward the retention module when the heat sink assembly is in a locked position.

Heat sink assembly with a locking device

A heat dissipation device includes a heat sink () in thermal contact with a first heat-generating electronic component. A fan duct () receives the heat sink therein and has an inlet () and an outlet () at opposite sides thereof. A fan () is mounted in the fan duct at the inlet. A portion of airflow generated by the fan flows through the heat sink to cool the first heat-generating electronic component. A shutter () is mounted on the fan duct. Another portion of the airflow generated by the fan flows through the shutter to blow a second heat-generating electronic component located beside the first heat-generating electronic component and outside the fan duct.

Heat dissipation device

A heat pipe type heat dissipation device for an electronic component comprises a base plate, a cover plate spaced from the base plate, a plurality of parallel fins extending between the base plate and the cover plate and connecting with them. The base plate, the cover plate and each two adjacent fins collectively define a unitary air passage. The base plate has a protuberant portion, which has a convex surface facing towards the cover plate and has a thickness getting small from the middle to two sides in a direction parallel to the fins. The cover plate also has a protuberant portion similar to the protuberant portion of the base plate. A heat pipe connects the protuberant portions of the cover plate and the base plate.

Heat pipe type heat dissipation device

A heat dissipation device for an electronic unit includes a heat sink (), a pair of fan holders () and a fan () mounted on the heat sink via the fan holders. The heat sink includes a base () with a plurality of fins () extending upwardly therefrom along a lateral direction thereof. The base forms a pair of lateral walls at two opposite lateral sides thereof. The fins are sandwiched between the lateral walls. A pair of supporting plates () extend from the lateral walls for mounting the fan holders on the heat sink. The fan holders cooperate with the lateral walls of the heat sink to encompass a top of the fins to prevent airflow generated by the fan from escaping from the top of the fins.

A heat sink () for a portable computer () includes a plurality of fins () located external to the portable computer, a conducting plate () extending into an inner space of the portable computer for absorbing heat in the portable computer, and a heat pipe () transferring the heat absorbed by the conducting plate to the fins. Therefore, the heat in the portable computer is removed from the inner space of the portable computer by the heat sink.

Heat sink for a portable computer

A back plate assembly () for a board () comprises a back plate () abutting against a side of the board and a plurality of posts (). Each post comprises at least one latching portion () formed thereon. After the latching portions have passed through the back plate and the board, the latching portions are blocked by one of the board and the back plate to secure the back plate to the board. Screws () are used to extend through a heat sink () to threadedly engage with the posts thereby mounting the heat sink to the board. Thus, the heat sink can have an intimate contact with an electronic component () mounted on the board.

Back plate assembly for a board

A fixing apparatus includes a retention module () and a back plate (). The retention module is attached on a printed circuit board (), which defines a plurality of through apertures (). The retention module comprises a plurality of posts () depending therefrom. Each post is hollow and aligned with a corresponding through aperture. The back plate is attached on a bottom surface of the printed circuit board, for reinforcing the printed circuit board. The back plate comprises a plurality of upwardly extending poles (). The poles extend through the through apertures and lock inside of the posts to secure the retention module and the back plate on opposites sides of the printed circuit board.

Growing community of inventors

Shenzhen, China

Jun Long