Mpi Corporation

Other

Mjc Probe Inc.

Jun-Liang Lai

Wei-Cheng Ku

Chih-Hao Ho

Hao Wei

Chun-Chung Huang

Wei Hsuan Chen

Chao-Ping Hsieh

Ho-Hui Lin

Te-Chen Feng

Horng-Chuan Sun

Kun-Han Hsieh

Yung Nan Wu

Ping-Hsiao Liao

Wen-Pin Su

Chih-Chung Chien

Chien-Huei Huang

Kuang Chung Chou

Ai-Chuan Chang

Jia-Chi Ho

Hsin Hsiang Liu

Yu-Chih Hsiao

Chan Hung Huang

Ta-Cheng Liao

Hsin-Hsiang Liu

Shung-Bo Lin

Kuang-Chung Chou

Shih-Ching Chen

Jing-Zhi Hung

Young-Huang Chou

A circuit board for semiconductor test includes first and second sub-circuit boards, and an insulating dielectric layer therebetween. Each sub-circuit board includes a substrate and circuits including upper and lower contacts. The insulating dielectric layer includes through holes, and connecting conductors disposed therein and electrically connected with the upper and lower contacts of two sub-circuit boards. The circuit board is defined with central and peripheral regions. The lower contacts of the first sub-circuit board in the central region are electrically connected with a probe head. The upper contacts of the second sub-circuit board in the peripheral region are electrically connected with a tester, larger in pitch than the lower contacts of the first sub-circuit board in the central region, and larger in amount than the lower contacts of the first sub-circuit board in the peripheral region. The circuit board has great power test uniformity.

Circuit board for semiconductor test

A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened.

Probe module supporting loopback test

A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

Multilayer circuit board

A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a band circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the band circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.

Probe card capable of transmitting high-frequency signals

A high-frequency cantilever type probe card includes a base board, a probe base provided on the base board, two probes, and a capacitor having opposite ends electrically connected to the probes respectively. The probe base is made of an insulating material, and the probes are made of a conductive material. Each of the probes has an arm and a tip, wherein the arm is connected to the probe base, and the tip is adapted to contact a pad of a DUT. When the DUT generates a testing signal with a high frequency, and the testing signal is transmitted to one of the probes, the capacitor, and the other one of the probes in sequence, and then transmitted back to the DUT.

Cantilever type probe card for high frequency signal transmission

A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a multiband circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the multiband circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.

A multilayer circuit board includes a plurality of stacked substrates, a plurality of first conductive lands, and a plurality of second conductive lands. A surface at a side of each of the substrates has an exposed portion which is not covered by the neighboring substrate, wherein each of the first conductive lands is respectively provided on each of the exposed portions. Each of the second conductive lands is provided on the exposed portion of the outermost substrate, wherein each of the substrates has a conductor pattern to be electrically connected to one of the first conductive lands and to one of the second conductive lands.

A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate has a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections.

A probe module, which supports loopback test and is provided between a PCB and a DUT, includes a substrate, a probe base, two probes, two signal path switchers, and a capacitor. The substrate has two first connecting circuits and two second connecting circuits, wherein an end of each first connecting circuit is connected to the PCB. The probe base is provided between the substrate and the DUT with the probes provided thereon, wherein an end of each probe is exposed and electrically connected to one second connecting circuit, while another end thereof is also exposed to contact the DUT. Each signal path switcher is provided on the probe base, and respectively electrically connected to another end of one first and one second connecting circuits. The capacitor is provided on the probe base with two ends electrically connected to the two signal path switchers.

A probe card, which is between a tester and a device under test (DUT), includes two first electrical lines, two second electrical lines, two inductive elements, and a capacitor. The first electrical lines are electrically connected to the probes respectively. The second electrical lines are electrically connected to the first electrical lines respectively. The inductive elements are electrically connected to the first electrical lines and the tester respectively; and the capacitor has opposite ends connected to the second electrical lines respectively.

Signal path switch and probe card having the signal path switch

A probe card, which is used to transmit power signals and test signals from a tester to a DUT, includes a pin base, a plurality of signal pins, a signal conducting circuit and at least one power conducting circuit. The signal pins are made of conductive materials, and each contacts the DUT with an end thereof; the signal conducting circuit has a first resistance, and electrically connects the tester and the other end of one of the signal pin to transmit the test signals to the DUT; the power conducting circuit has a second resistance which is much less than the first resistance, and electrically connects the tester and the other end of one of the signal pin which is not connected with the signal conducting circuit to transmit the power signals to the DUT.

Probe card of low power loss

A probe card is provided. The probe card can serialize, analogize and divide a digital signal by a analog-to-digital converter (ADC), a digital-to-analog converter (DAC), and a power divided unit respectively. The probe card can increase signal channels, and is not restricted by signal channels of a tester to test more DUTs simultaneously. Moreover, the probe card has fine impedance matching and channels separating to raise testing efficiency and reduce signal loss.

Probe card

A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.

Growing community of inventors

Zhubei, Taiwan

Jun-Liang Lai