Georgia Tech Research Corporation

Jun Li

Paul Albert Kohl

Ching-Ping Wong

Franklin Lambert

Lianhua Fan

Christopher W Moore

Methods of reducing pollution problems in power lines systems are disclosed herein. In one embodiment, the method comprises applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications. Further disclosed are methods of fabricating/preparing Lotus Effect coatings. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability. Other aspects, features, and embodiments are also discussed and claimed.

Insulator coating for reducing power line system pollution problems

A fuel cell includes a porous frit based composite proton exchange membrane. The pores of the porous frit are filled with a proton-conducting material.

Fuel cell with porous frit based composite proton exchange membrane

Fuel cells, fuel cell membranes, micro-fuel cells, and methods of fabricating each, are disclosed.

Microstructures and methods of fabrication thereof

The present invention is a method of applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications, as well as the method of fabricating/preparing Lotus Effect coatings. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability.

Insulator coating and method for forming same

Electroless copper plating solutions and methods of use thereof are disclosed. A representative electroless copper plating solution includes a reducing agent that is a source of hypophosphite ions and at least one accelerator compound that accelerates the rate of copper deposition.

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Atlanta, GA, United States of America

Jun Li