Solum Co., Ltd.

Uppthera

Lg Display Co., Ltd.

Atum Co., Ltd.

Jun Kyu Lee

Dong Kyun Ryu

Sang Keun Ji

Seong Hoon Kim

Soo Hee Ryu

Hye Guk Ryu

Im Suk Min

Hyun Su Kim

Han Kyu Lee

Keum Young Kang

Gibbeum Lee

So Hyun Chung

Sang Youn Kim

Young Jun Jang

Pill Ju Kim

Su Young Kim

Yong Woo Kang

Eun Sik Kim

Jeong Kweon Park

Sang-keun Ji

Hwa Jin Lee

Dong-kyun Ryu

Si Woo Choi

Ji Hoon Ryu

San Ha Son

Eun Bin Lee

Seong Kwon

Changyong Kwon

Taeksoo Han

Jung Soo Lee

Tai Hyun Lim

The present invention relates HMG-CoA reductase degradation inducing compounds. Specifically, the present invention relates a bifunctional compound in which a HMG-CoA reductase binding moiety and an E3 ubiquitin ligase-binding moiety are linked by a chemical linker. The present invention also relates a method for preparing the compounds, and a method for degradation of HMG-CoA reductase using the compounds, as well as use for prevention or treatment of HMG-CoA reductase related diseases using the compounds.

HMG-CoA reductase degradation inducing compound

Provided are an electric appliance and a method of manufacturing the same, the electric appliance having a smaller size and a reduced overall weight by preventing a fluid from flowing into a space unrelated to a heating component in a state where the fluid fills its case. The electric appliance includes: a case including a first space and a second space communicated to each other; a first component disposed in the first space; a second component disposed in the second space; a connection portion electrically connecting the first component and the second component to each other; and a potting pattern including a resin material and formed in the first space.

Electric appliance and adapter

The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.

Electrical device having heat dissipation structure using filler and manufacturing method of the same

The present disclosure relates to a novel PLK1 degradation inducing compound having a structure according to Formula I, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.

Substituted pyrimido[4,5-b][1,4]diazepines as PLK1 degradation inducers

The present invention relates to an electrical device including a printed circuit board (PCB) accommodated in a case, and more particularly, to an air-pocket prevention PCB, an air-pocket prevention PCB module, an electrical device including the same, and a manufacturing method of an electrical device including the same with improved fluidity of a resin material so that air pockets that may occur when the case is filled with the resin material are easily discharged and the resin material may be evenly filled inside the case.

Air-pocket prevention PCB, air-pocket prevention PCB module, electrical device including the same, and manufacturing method of electrical device including the same

A transformer includes: an upper primary substrate () which is formed by stacking a plurality of dielectric substrates, each substrate being provided with spiral conductive patterns; a lower secondary substrate () which is formed by stacking a plurality of dielectric substrates, each substrate being provided with spiral conductive patterns, in which the lower secondary substrate is positioned below the upper primary substrate () in such a way that the lower secondary substrate comes into contact with the upper primary substrate () or is spaced apart from the upper primary substrate (); and a secondary coil element () of a planar shape to produce an induced current by a current applied to the upper primary substrate () and the lower primary substrate ().

Transformer

A slit coater including buffer members having elasticity and installed at both sides of a slit nozzle unit, compensating for a height difference between both sides, preventing breakdown due to excessive stress generated by the height, and reducing set-up time. The slit coater includes: a table on which an object to be processed is mounted; a slit nozzle unit formed above the table for applying coating solution onto the object; a driving unit moving the slit nozzle unit in a predetermined direction; and buffer members having elasticity installed at both sides of the slit nozzle unit.

Slit coater

Growing community of inventors

Gyeonggi-do, South Korea

Jun Kyu Lee