Kuraray Europe Gmbh

Kuraray Co., Ltd.

Jun Koishikawa

Koichiro Isoue

Uwe Keller

Yoshihiro Morishita

Masahiro Kato

Yasushi Senda

Yuhi Shimazumi

Hiroyuki Arishima

Hirotaka Yasuda

A circuit-including film comprising: a resin film (); and a conductive fine wire circuit (A) and a conductive circuit (B) independent of the conductive fine wire circuit (A), which are arranged on one surface of the resin film (), wherein the resin film () contains at least one resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin and an ethylene-(vinyl acetate) copolymer resin.

Circuit-including film

A polyvinyl acetal resin film for laminated glass,

Polyvinyl acetal resin film for laminated glass

Provided are a foam molded body capable of improving damping properties and sound insulation properties of a panel and realizing weight reduction of a panel, a dam rubber, a complex of a dam rubber and a panel, and a method for increasing a sound transmission loss. The present invention is concerned with a foam molded body of a resin composition containing a block copolymer (I) which is a block copolymer having a polymer block (A) composed mainly of a structural unit derived from an aromatic vinyl compound and other polymer block (B), exhibits a peak top temperature of tan &#x3b4;, as measured under a condition of a thickness of a test piece of 1 mm, a strain amount of 0.1%, a frequency of 1 Hz, a measurement temperature of &#x2212;70 to 70&#xb0; C., and a temperature rise rate of 3&#xb0; C./min in conformity with JIS K7244-10 (2005), of &#x2212;50 to 50&#xb0; C., and has a peak top molecular weight determined in terms of standard polystyrene by gel permeation chromatography of 30,000 to 500,000; at least one olefin-based polymer (II) selected from the group consisting of an ethylene-propylene-diene copolymer rubber, an ethylene-vinyl acetate copolymer, and a polyethylene-based resin; a crosslinking agent (III); and a foaming agent (IV).

Molded foam body, dam rubber, composite body of dam rubber and panel, and method for increasing sound transmission loss

Growing community of inventors

Chiyoda-ku, Japan

Jun Koishikawa