Nichia Corporation

Jun Kawamata

Takao Kosugi

Isamu Niki

Naoki Saka

A method for manufacturing a wavelength conversion member includes: forming a phosphor layer on a base body including phosphor particles and oxide particles affixed to surfaces of the phosphor particles; and forming a cover layer covering the surfaces of the phosphor particles and surfaces of the oxide particles continuously, and having a same oxide material as the oxide particles. A wavelength conversion member includes: a base body, a phosphor layer disposed on the base body and including phosphor particles and oxide particles affixed to surfaces of the phosphor particles; and a cover layer covering the surfaces of the phosphor particles and surfaces of the oxide particles continuously, and including a same oxide material as the oxide particles.

Method for manufacturing wavelength conversion member

A wavelength converting device includes a heat dissipating member, a wavelength converting member, and a connecting member. The wavelength converting member is disposed on the heat dissipating member and contains a fluorescent material and a holding body including aluminum oxide, magnesium oxide, zirconium oxide, lutetium oxide, titanium oxide, chromium oxide, tungsten oxide, divanadium pentoxide, molybdenum trioxide, sodium oxide, yttrium oxide, silicon dioxide, boron oxide, or diphosphorus pentoxide. The connecting member contains a metal material and connecting the heat dissipating member and the wavelength converting member. The wavelength converting member includes an upper surface, side surfaces, and a lower surface. The connecting member is thermally connected to the side surfaces and the lower surface of the wavelength converting member.

Wavelength converting device

(Problem to be Solved) To provide a wavelength converting device which can efficiently exhaust heat from the wavelength converting member using a heat dissipating member. (Solution) The wavelength converting device includes a heat dissipating member, a wavelength converting member disposed on the heat dissipating member, and a connecting member which connects the heat dissipating member and the wavelength converting member. Particularly, the wavelength converting member includes an upper surface, side surfaces, and a lower surface, and the connecting member is thermally connected to the side surfaces and the lower surface of the wavelength converting member.

Growing community of inventors

Tokushima, Japan

Jun Kawamata