Denso Corporation

Toyota Jidosha Kabushiki Kaisha

Mitsubishi Electric Corporation

Jun Kawai

Kazuhiko Sugiura

Norihito Tokura

Takeshi Endo

Tomohito Iwashige

Tsuyoshi Yamamoto

Yukihiko Watanabe

Eiichi Okuno

Narumasa Soejima

Takeo Yamamoto

Hirokazu Fujiwara

Kazuhiro Tsuruta

Kensaku Yamamoto

Nobuyuki Kato

Masaki Konishi

Takashi Katsuno

Kayo Kondo

Tetsuji Kondou

Yasuji Kimoto

A silicon carbide semiconductor device includes a silicon carbide semiconductor substrate having a front surface and a rear surface, and an ohmic electrode in ohmic contact with silicon carbide of at least one of the front surface or the rear surface of the silicon carbide semiconductor substrate. The ohmic electrode is made of Ni containing 0.1 wt % or more and 15 wt % or less of P as an impurity. The ohmic electrode contains Ni silicide including NiSi. The ohmic electrode further contains NiPin the Ni silicide. A method for manufacturing the silicon carbide semiconductor device includes forming a metal thin film on the silicon carbide that is to be in ohmic contact with the ohmic electrode, and forming the ohmic electrode by laser annealing that includes irradiating the metal thin film with laser light and reacting the Ni with Si in the silicon carbide to generate Ni silicide.

Silicon carbide semiconductor device and method for manufacturing the same

A semiconductor device includes a semiconductor chip having an electrode portion and a joining member electrically connected to the electrode portion to allow an electric current to flow in the semiconductor chip through the joining member. The joining member contains a protective material that has a positive temperature coefficient of resistivity, and the positive temperature coefficient of resistivity has a larger value in a temperature range higher than a threshold temperature than in a temperature range lower than the threshold temperature, the threshold temperature being a predetermined temperature lower than a breakdown temperature of the semiconductor chip. The electrode portion of the semiconductor chip may contain the protective material.

Semiconductor chip and semiconductor device

A semiconductor device includes: a mounting member having an electrode; a conductive member facing the electrode; and a bonding member electrically and mechanically connecting the electrode and the conductive member. The bonding member is made of a sintered body in which an additive particle including a metal atom having aggregation energy higher than a silver atom is added to an silver particle.

Semiconductor device

A silicon carbide semiconductor device includes: a semiconductor substrate that has a front surface and a rear surface, and is made of silicon carbide; and an ohmic electrode that is ohmically connected to the front surface or the rear surface of the semiconductor substrate. The ohmic electrode includes a metal silicide part and a metal carbide part. The metal silicide part surrounds a periphery of the metal carbide part that has a block shape. The metal silicide part is disposed between the semiconductor substrate and the metal carbide part.

Silicon carbide semiconductor device having metal silicide surrounds a peripheral of metal carbide

In a manufacturing method of a silicon carbide semiconductor device, a semiconductor substrate made of single crystal silicon carbide is prepared. At a portion of the semiconductor substrate where a first electrode is to be formed, a metal thin film made of electrode material including an impurity is formed. After the metal thin film is formed, the first electrode including a metal reaction layer in which the impurity is introduced is formed by irradiating the metal thin film with a laser light.

Silicon carbide semiconductor device and method of manufacturing the same

A silicon carbide semiconductor device includes: a semiconductor substrate made of silicon carbide single crystal and having a principal surface and a backside; and an ohmic electrode contacting one of the principal surface and the backside of the semiconductor substrate in an ohmic manner. A boundary between the ohmic electrode and the one of the principal surface and the backside of the semiconductor substrate is terminated with an element, which has a Pauling electronegativity larger than silicon and a binding energy with silicon larger than a binding energy of Si&#x2014;H.

Silicon carbide semiconductor device and manufacturing method of the same

A manufacturing method of a semiconductor device having an ohmic electrode is disclosed. The manufacturing method includes: forming a metal thin film on a rear surface of a semiconductor substrate; forming an ohmic electrode by laser annealing by irradiating the metal thin film with laser beam; and dicing the semiconductor substrate into chips by cutting at a dicing region of the semiconductor substrate. In forming the ohmic electrode, laser irradiation of the metal thin film is performed on a chip-by-chip basis while the dicing region is not being irradiated with the laser beam.

Manufacturing method of semiconductor device

A method for manufacturing a semiconductor device including a semiconductor substrate composed of silicon carbide, an upper surface electrode which contacts an upper surface of the substrate, and a lower surface electrode which contacts a lower surface of the substrate, the method including steps of: (a) forming an upper surface structure on the upper surface side of the substrate, and (b) forming a lower surface structure on the lower surface side of the substrate. The step (a) comprises steps of: (a1) depositing an upper surface electrode material layer on the upper surface of the substrate, the upper surface electrode material layer being a raw material layer of the upper surface electrode, and (a2) annealing the upper surface electrode material layer. The step (b) comprises steps of: (b1) depositing a lower surface electrode material layer on the lower surface of the substrate, the lower surface electrode material layer being a raw material layer of the lower surface electrode, and (b2) annealing the lower surface electrode material layer with a laser to make an ohmic contact between the lower surface electrode and the substrate.

Semiconductor device manufacturing method

In a method of manufacturing a silicon carbide semiconductor device, a semiconductor substrate made of silicon carbide and having first and second opposing surfaces is prepared. The second surface of the semiconductor substrate is processed so that a surface roughness of the second surface is less than or equal to 10 nm and a value of (100%-reflectance-transmittance) at a wavelength of a laser light is greater than or equal to 80%. A metal layer is formed on the second surface of the semiconductor substrate after the processing the second surface. The metal layer is irradiated with the laser light and thereby an ohmic electrode is formed on the second surface.

Method of manufacturing silicon carbide semiconductor device

A silicon carbide semiconductor device having a MOS structure includes: a substrate; a channel area in the substrate; a first impurity area; a second impurity area; a gate insulating film on the channel area; and a gate on the gate insulating film. The channel area provides an electric current path. The channel area and the gate insulating film have an interface therebetween. The interface includes a dangling bond, which is terminated by a hydrogen atom or a hydroxyl. The interface has a hydrogen concentration equal to or larger than 2.6&#xd7;10cm.

Growing community of inventors

Anjo, Japan

Jun Kawai