Honda Motor Co., Ltd.

Jun Kato

Ryota Kitamoto

Takaaki Fushimi

Yusuke Shindo

Kosuke Nishiyama

Shinnosuke Sato

Toshiki Ikeda

Takanori Sakaguchi

Masaki Ueno

Masami Ogura

Hajime Uto

Naoki Inoue

Tsukasa Aiba

Takahiro Hagimoto

Fumitomo Takano

Kensuke Yamamoto

Yuko Yamada

Kenji Tsukahara

Takahito Takayanagi

Tsukasa Itou

Nobuyuki Oda

Yoshiharu Ishigami

Tsugio Masuda

An electric power conversion device of an embodiment includes: a primary side negative electrode terminal; a secondary side negative electrode terminal; a negative electrode terminal of a switching element connected between the primary side negative electrode terminal and the secondary side negative electrode terminal; a first conductive member connected to the primary side negative electrode terminal; a second conductive member connected to the negative electrode terminal of the switching element; and a third conductive member connected to the secondary side negative electrode terminal, wherein the first conductive member, the second conductive member, and the third conductive member are connected to one another, and the first conductive member is formed as a separate body separately from the second conductive member and the third conductive member.

Electric power conversion device

A heat radiation structure of an electric parts assembly, a heat conduction sheet, and a method of manufacturing an electric parts assembly are provided that are capable of reducing a gap between neighboring separate sheets after sheet compression while minimizing an unintentional increase in sheet reaction force. A heat conduction sheet (A) disposed between a cooler and a heat generating element includes a plurality of separate sheets (), each of the separate sheets () includes a plurality of convex sections protruding circumferentially outward from the sheet and a plurality of concave section recessed circumferentially inward on an outer circumferential edge of a shape when seen in a plan view in a state before being pinched between a cooler and a heat generating element, and the convex sections and the concave sections are disposed to be arranged alternately in a circumferential direction of the separate sheets () in a shape when seen in a plan view. When the plurality of separate sheets () are pinched between the cooler and the heat generating element, the gap between the neighboring separate sheets () is reduced by changing a shape of the outer circumferential edge of the plurality of separate sheets () to fill the neighboring concave sections.

Heat radiation structure of electric parts assembly, heat conduction sheet, and method of manufacturing electric parts assembly

An electric power conversion device is provided with a case () which includes: a first member () having a first region () defining therein a first passage () in which a cooling medium flows, and a second region () disposed on a side of the first region; and a second member () disposed so as to at least partly overlap with the second region as seen from a direction orthogonal to the second region in a spaced apart relationship to the second region, and internally defining a second passage () connected to the first passage. A reactor () is positioned in the first region, and a switching device () is positioned on the surface of the second member facing away from the first member while a capacitor () is positioned between the second member and the second region of the first member.

An electric power conversion device is provided with a case () including a mounting portion () extending along a plane defined by a first direction and a second direction that are orthogonal to each other, and a side wall () provided along a periphery of the mounting portion, a primary side connection portion () and a secondary side connection portion () provided on the case, a plurality of reactors arranged along the second direction in the case and connected in parallel to one another, and a switching unit including a plurality of switching devices positioned in the case on one side of the reactors in the first direction, arranged along the first direction, and respectively connected to the reactors.

A valve reference position-learning device for an internal combustion engine, which is capable of accurately learning the reference position of a valve both before and after the warm-up of the engine, while properly reflecting thereon a deviation of the reference position caused by the thermal elongation of the valve and drive system after the warm-up of the engine. The valve reference position-learning device calculates and updates a learned value of the reference position of the wastegate valve both at and after the start of the engine, by first and second learnings, respectively. The learned value calculated by the first learning is stored as an existing learned value. Further, at the start of the engine, if the calculation of the learned value is not completed, the learned value is set to the existing stored learned value.

Valve reference position-learning device for internal combustion engine

A control system for an internal combustion engine where when the engine is decelerating the amount of intake air supplied to a combustion chamber is controlled. A target auxiliary intake air amount SAIRCMD necessary for preventing misfiring of the engine by supplying only an auxiliary intake air amount to a combustion chamber and a target intake air amount GAIRCMD which is a target value of the amount of intake air supplied to the combustion chamber are calculated according to the state NE, AP of the engine. When the engine is decelerating, and misfires, misfire avoidance control is executed controlling an auxiliary intake air amount control valve to be more opened such that the auxiliary intake air amount becomes the target auxiliary intake air amount SAIRCMD and a throttle valve to be more closed such that the amount of intake air supplied to the combustion chamber becomes the target intake air amount GAIRCMD.

Control system for internal combustion engine

There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.

Semiconductor device having thermal endurance and method of manufacturing the same

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Wako, Japan

Jun Kato