Yamaha Corporation

Dai Nippon Printing Co., Ltd.

Jun Kato

Tsuyuki Watanabe

Koji Tomita

Kazunori Kato

Naofumi Nakamura

In a leadframe for supporting semiconductor devices and including a plurality of outer lead sections, a recess or recesses are provided on each of the outer lead sections at a central portion or both sides of each outer lead section in a region including a cutting line. The recess or recesses reduce the cross-sectional area of the lead section, thus enabling a new cut surface of the lead section to be well covered by solder and enabling ready cutting of the lead section.

Leadframe adapted to support semiconductor elements

In composition of Fe-Ni alloy preferably used for lead frames in production of IC, specified amount of Be is added to the basic composition for increase in mechanical strength whilst maintaining the low thermal expansion characteristic of the conventional Fe-Ni alloys.

Fe-Ni alloy and method for producing the same

In composition of a Fe-Ni alloy used for television shadow masks and containing in, Co, Mn, Si and Cr as the major components, additional inclusion of Be assures high deformation resistance and easy pore formation via etching without impairing its inherent low thermal expansion. Introduction of annealing at 800.degree. to 1200.degree. C. temperature into production process sufficiently lowers proof stress of the product without causing any noticeable crystal coarseness. Increased mechanical strength enables production of a thin shadow mask material well suited for pore formation via etching, thereby assuring high grade screen display.

Method for manufacturing a shadow mask of a Fe-Ni alloy

In composition of Fe-Ni alloy preferably used for lead frames in production of IC, specified amount of Be is added to the basic composition for increase in mechanical strength while maintaining the low thermal expansion characteristic of the conventional Fe-Ni alloys.

Growing community of inventors

Shizuoka, Japan

Jun Kato