Lenovo (singapore) Pte. Ltd.

Jun Kaminaga

Kenji Watamura

Hirohide Komiyama

An electronic device is provided with a substrate mounted with an electronic component, an expansion card disposed at an interval from the substrate, a flexible printed circuit electrically connecting the substrate and the expansion card, a connector which is provided in the flexible printed circuit and to which a terminal of the expansion card is connected, a cooling unit having a heat transport member thermally connected to the electronic component and a cooling fan cooling the heat transport member, a bracket fixed to the connector, and a chassis housing the substrate, the expansion card, the flexible printed circuit, the connector, the cooling unit, and the bracket, in which the cooling fan is disposed between the substrate and the expansion card and overlaps with the flexible printed circuit in the plan view and the bracket is fixed to the chassis.

Electronic device with reduced chassis thickness

An electronic component includes a first substrate including first connection terminals in an end region on a first surface; and a second substrate including second connection terminals on a first surface, the second connection terminals being disposed at a position corresponding to the first connection terminals. Each of the first connection terminals includes a base and an elastic contact piece extending from the base. The elastic contact piece is elastically deformable in a direction in which the tip end portion thereof approaches and departs with respect to the base. The first connection terminals are electrically connected to the second connection terminals while having the first surface of the first substrate being opposed to the first surface of the second substrate, and the second connection terminals being pressed onto the elastic contact pieces.

Growing community of inventors

Tokyo, Japan

Jun Kaminaga