Stats Chippac Pte. Ltd.

Jun Jie Xu

Jae Hak Yee

Frederick Cruz Santos

Yong Yong Xia

An integrated circuit package system comprising: providing an integrated circuit die having an active side; forming a first internal stacked module and a second internal stacked module over the active side of the integrated circuit die; and coupling an electrical interconnect between the first internal stacked module or the second internal stacked module and the active side.

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Shanghai, China

Jun Jie Xu