Nitto-denko Corporation

Jun Ishii

Yasunari Ooyabu

Toshiki Naito

Yasuhito Funada

Yoshito Fujimura

Hitoki Kanagawa

Naohiro Terada

Terukazu Ihara

Tetsuya Ohsawa

Visit Thaveeprungsriporn

Goji Shiga

Mitsuru Honjo

Kensuke Nishi

Toshiki Naitou

Chie Iino

Hiroyuki Kurai

Takeshi Tanaka

Eiji Toyoda

Yuu Sugimoto

Yasuhito Ohwaki

Daisuke Yamauchi

Kosuke Morita

Takahiko Yokai

Saori Kanezaki

Kouji Ichinose

Tsuyoshi Ishizaka

Hirotoshi Iguchi

Saori Ishigaki

Takeshi Yoshimi

Aya Mizushima

Saori Kanazaki

A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.

Printed circuit board assembly sheet and method for manufacturing the same

Provided is a sealing sheet capable of preventing void and filler segregation from occurring when forming a sealing body in which semiconductor chips are buried in the sealing sheet. The sealing sheet has a viscosity within the range of 1 Pa&#xb7;s to 50000 Pa&#xb7;s at 90&#xb0; C.

Sealing sheet

A read wiring trace and a write wiring trace are formed on an insulating layer. Connection terminals made of conductor are connected to the read wiring trace and the write wiring trace, respectively. Each connection terminal has at least one corner with a radius of curvature of not larger than 35 &#x3bc;m.

Printed circuit board, method of manufacturing the same and connection terminal

The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150&#xb0; C. for 1 hour is 125&#xb0; C. or higher, and a thermal expansion coefficient &#x3b1; [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E' [GPa] at 25&#xb0; C. of the thermally cured product satisfy the following formula (2):30&#x2266;&#x2266;120 [kJ/mol]&#x2003;&#x2003;(1); and10,000&#x2266;&#x3b1;&#xd7;&#x2032;&#x2266;300,000 [Pa/K]&#x2003;&#x2003;(2).

Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package

Method of manufacturing a printed circuit board assembly sheet

A plurality of suspension boards and an inspection substrate are integrally supported by a support frame. In each suspension board, a line is formed on a conductive first support substrate via a first insulating layer. The first support substrate and the line are electrically connected by a first via in the first insulating layer. In the inspection substrate, a conductor layer is formed on a conductive second support substrate with a second insulating layer sandwiched therebetween. The second support substrate and the conductor layer are electrically connected by a second via in the second insulating layer. The first via and the second via have the same configuration.

Suspension board assembly sheet with circuits and method for manufacturing the same

A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side thereof in a thickness direction which is exposed through the first opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is exposed through the second opening and configured as a second terminal portion. The metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion located on a surface on the other side of the covering portion in the thickness direction.

Wired circuit board

A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.

Wired circuit board and producing method thereof

A wired circuit board includes an insulating layer, and a conductive layer including a wire covered with the insulating layer and a terminal continued to the wire to electrically connect the wire to an electronic element. The insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern which is indented in a thickness direction.

A suspension board with circuit for mounting a slider unit including an electron device, the electron device being mounted so as to form, when projected in the thickness direction with respect to the slider provided with a magnetic head, an overlapping portion that overlaps with the slider, and a protruding portion that protrudes from the slider. The suspension board with circuit is formed with a first opening penetrating in the thickness direction and accommodates the overlapping portion, and a second opening that communicates with the first opening and accommodates the protruding portion.

Suspension board with circuit

A wired circuit board includes an insulating layer to be formed with an opening extending therethrough in a thickness direction of the wired circuit board, a conductive layer formed on one surface of the insulating layer in the thickness direction and including a one-side terminal portion, an other-side terminal portion formed on the other surface of the insulating layer in the thickness direction, disposed so as to overlap the opening and the one-side terminal portion when projected in the thickness direction, and used to be connected to an electronic element via a conductive adhesive, and a conductive portion filling the opening to provide electrical conduction between the one-side terminal portion and the other-side terminal portion.

Wired circuit board including an insulating layer formed with an opening filled with a conductive portion and producing method thereof

Base insulating layers are formed on a support substrate having a conductive property. The support substrate is etched, to form support substrate board and a plurality of conductive portions in a suspension board. The holding piece and the conductive portions constitute a shape determination unit. The conductive portions have first to fifth conductive portions. The third and fourth conductive portions are spaced apart from each other, and the fifth conductive portion is formed between the third and fourth conductive portions. The first and second conductive portions are respectively formed integrally with one end and the other end of the fifth conductive portion. It is determined whether the first and second conductive portions in the shape determination unit are connected electrically to each other. And it is determined whether the first and third conductive portions are connected electrically to each other.

Method for manufacturing printed circuit board, method for manufacturing printed circuit board assembly sheet, printed circuit board, and printed circuit board assembly sheet

A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer and having a terminal portion connected to connecting terminals of a magnetic head mounted on a slider. A slider mounting region where the slider is disposed is defined, and a plurality of the terminal portions are spaced apart from each other in the slider mounting region, and in the metal supporting board, an opening which opens so as to expose the insulating layer where the terminal portions are disposed is formed at the slider mounting region.

Method of producing a suspension board with circuit

An insulating layer is formed on a support substrate having a conductive property. Write wiring traces, read wiring traces, and first and second electrode pad pairs are formed on the insulating layer. The first electrode pad pair is connected to the write wiring traces. The second electrode pad pair is connected to the read wiring traces. Parts of regions of the support substrate, which overlap the electrode pads, are removed. Thus, openings are formed in the regions of the support substrate, which overlap the electrode pads.

Growing community of inventors

Osaka, Japan

Jun Ishii