Dongbu Hitek Co., Ltd.

Jun Il Kim

Sung Jin Kim

Hag Mo Kim

Provided is a chip on film (COF) type semiconductor package. The COF type semiconductor device includes a flexible film, an electrode pattern formed on the flexible film, a semiconductor device disposed on the electrode pattern, a conductive pad disposed between the electrode pattern and the semiconductor device to electrically connect the semiconductor device with the electrode pattern, and a first protective layer which seals the conductive pad and the semiconductor device and is formed on a portion of the electrode pattern and the semiconductor device. The first protective layer includes a heat conductive material for dissipating heat generated from the semiconductor device.

Growing community of inventors

Gyeonggi-do, South Korea

Jun Il Kim